LMP2231AMAE Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TEXAS INSTRUMENTS - LMP2231AMAE - Operational Amplifier, Single, 1 Amplifier, 130 kHz, 0.058 V/µs, 1.6V to 5.5V, SOIC, 8 Pins
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- LMP2231AMAE Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LMP2231AMAE?
- Integrated Circuit from Texas Instruments for production electronic assemblies
- Small Outline Packages package with 8 pins for PCB footprint planning
- -40°C to 125°C operating temperature range for environmental screening
- Datasheet context includes 2231A for engineering cross-checks
- Manufacturer or distributor datasheet URL available for technical verification
- Suitable for embedded systems, industrial electronics, communication equipment applications
What is LMP2231AMAE used for?
LMP2231AMAE is commonly used in embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing where designers need dependable integrated circuit behavior and manufacturer-traceable sourcing. It is appropriate for production BOM builds, repair demand, and alternate qualification workflows that compare package fit, lifecycle status, and parameters such as 8 pins.
What are the specifications of LMP2231AMAE?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.000005 µA |
| Bias Current-Max (IIB) @25C | 0.000001 µA |
| Common-mode Reject Ratio-Min | 77dB |
| Common-mode Reject Ratio-Nom | 91dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 275 µV |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e0 |
| Low-Bias | YES |
| Low-Offset | YES |
| Micropower | YES |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 235 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 0.058V/us |
| Supply Current-Max | 0.015mA |
| Supply Voltage Limit-Max | 6V |
| Supply Voltage-Nom (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | TIN LEAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 128 |
| Voltage Gain-Min | 158489.3 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the LMP2231AMAE datasheet?
LMP2231AMAE Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LMP2231AMAE?
Compatible alternatives and drop-in replacements for LMP2231AMAE:
Frequently Asked Questions
Which design use cases are a practical fit for LMP2231AMAE?
LMP2231AMAE is a Integrated Circuit from Texas Instruments suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 8 pins detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.
How should engineers check package compatibility for LMP2231AMAE during layout review?
Use the Small Outline Packages package information together with 8 pins when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.
What should procurement keep aligned when cross-referencing LMP2231AMAE against alternates?
Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as -40°C to 125°C. Matching these details lowers substitution risk across 1 approved BOM.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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