LMK1C1108 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The LMK1C1108 is a Texas Instruments clock buffer and fanout IC providing 8 outputs in a low-profile TSSOP package with a maximum height of 1.2 mm. It distributes a single clock input to multiple system destinations with minimal skew and low additive jitter for synchronous digital designs. Available from authorized distributors with worldwide shipping for clock distribution network applications.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- LMK1C1108 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LMK1C1108?
- 8-output clock fanout buffer with low output-to-output skew ensuring synchronous clocking across multiple logic devices on the same PCB
- Low additive jitter performance preserving clock signal integrity for high-speed memory interfaces, FPGAs, and multi-processor synchronization
- Ultra-thin TSSOP package with 1.2 mm maximum height enabling use in height-constrained embedded and portable system designs
What is LMK1C1108 used for?
The LMK1C1108 is used in FPGA clock distribution networks, DDR memory interface timing trees, and multi-processor embedded systems where a single reference clock must be fanned out to 8 destinations with consistent phase alignment. Its low-profile TSSOP package also makes it suitable for space-constrained telecom line cards, industrial control modules, and compact computing appliances requiring low-skew clock delivery.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the LMK1C1108 datasheet?
LMK1C1108 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LMK1C1108?
Compatible alternatives and drop-in replacements for LMK1C1108:
Low Skew Clock Driver, LMK Series, 8 True Output(s), 0 Inverted Output(s), PDSO16
Frequently Asked Questions
How many clock output copies does the LMK1C1108 provide and what clock distribution topologies does it support?
The LMK1C1108 provides 8 buffered clock outputs from a single input, enabling star-topology clock distribution to up to 8 FPGAs, ASICs, or logic devices simultaneously; the equal-length fanout minimizes output-to-output skew compared to daisy-chained buffers, which accumulate propagation delay and skew through each stage.
What is the package height of the LMK1C1108 and why does this matter for board-level integration?
The LMK1C1108 has a maximum package height of 1.2 mm in TSSOP format, allowing it to fit under stacked PCB assemblies, within enclosed modules with 2 mm to 3 mm board-to-board clearance, and in slim portable electronics where taller SO-8 or SOIC packages exceeding 1.75 mm would conflict with mechanical constraints.
In what ways does the LMK1C1108 reduce clock skew compared to passive resistor-splitter clock distribution networks?
A passive resistor splitter creates impedance mismatch and signal attenuation that varies by load, producing skew differences of 200 ps to 500 ps between outputs; the LMK1C1108 active buffer drives all 8 outputs from matched internal drive stages, reducing output-to-output skew to typically under 50 ps and maintaining consistent rise and fall times across all destinations.
Which system architectures benefit most from deploying the LMK1C1108 as a clock distribution solution?
Architectures with 4 to 8 synchronous devices including DDR3 or DDR4 memory controllers clocked at 100 MHz to 200 MHz, multi-FPGA boards sharing a 125 MHz reference, and networking line cards requiring sub-100 ps skew across PHY and MAC devices benefit most, as the LMK1C1108 eliminates the need for 8 separate oscillators or manual PCB trace-length matching to achieve phase alignment.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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