LMC6464BIM/NOPBAlternatives & Equivalent Parts

About LMC6464BIM/NOPB

LMC6464BIM/NOPB is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

Specification Comparison

ParameterLMC6464BIM/NOPBSourceLMC6464AIM/NOPBLMC6464BIMLMC6464AIM
ManufacturerTexas InstrumentsTexas InstrumentsTexas InstrumentsTexas Instruments
Package TypeSmall Outline PackagesSmall Outline PackagesSmall Outline Packages
Pin Count141414
Temperature Range-40.0°C ~ 85.0°C-40.0°C ~ 85.0°C-40.0°C ~ 85.0°C
Price$2.1450$2.3880$2.1450$2.3880
Electrical Parameters
YTEOL000
Amplifier TypeOPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACKVOLTAGE-FEEDBACKVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.00001 µA0.00001 µA0.00001 µA
Bias Current-Max (IIB) @25C0.0000015 µA0.0000015 µA0.0000015 µA
Common-mode Reject Ratio-Min70 dB70 dB70 dB
Common-mode Reject Ratio-Nom85 dB85 dB85 dB
Frequency CompensationYESYESYES
Input Offset Current-Max (IIO)0.000005 µA0.000005 µA0.000005 µA
Input Offset Voltage-Max500 µV500 µV500 µV
JESD-30 CodeR-PDSO-G14R-PDSO-G14R-PDSO-G14
JESD-609 Codee3e3e0
Low-BiasYESYESYES
Low-OffsetNONONO
MicropowerYESYESYES
Number of Functions444
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOP14,.25SOP14,.25SOP14,.25
Package ShapeRECTANGULARRECTANGULARRECTANGULAR
Package StyleSMALL OUTLINESMALL OUTLINESMALL OUTLINE
Packing MethodTUBETUBETUBE
Peak Reflow Temperature (Cel)260260NOT SPECIFIED
PowerNONONO
Programmable PowerNONONO
Qualification StatusNot QualifiedNot QualifiedNot Qualified
Slew Rate-Min8000 V/us8000 V/us8000 V/us
Slew Rate-Nom0.028 V/us0.028 V/us0.028 V/us
Supply Current-Max0.11 mA0.11 mA0.11 mA
Supply Voltage Limit-Max16 V16 V16 V
Supply Voltage-Nom (Vsup)5 V5 V5 V
Surface MountYESYESYES
TechnologyCMOSCMOSCMOS
Temperature GradeINDUSTRIALINDUSTRIALINDUSTRIAL
Terminal FinishMatte Tin (Sn)Matte Tin (Sn)Tin/Lead (Sn/Pb)
Terminal FormGULL WINGGULL WINGGULL WING
Terminal Pitch1.27 mm1.27 mm1.27 mm
Terminal PositionDUALDUALDUAL
Time@Peak Reflow Temperature-Max (s)3030NOT SPECIFIED
Unity Gain BW-Nom505050
Voltage Gain-Min333
WidebandNONONO
Pbfree CodeYes

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

Quick Links

LMC6464AIM/NOPBby Texas Instruments

Operational Amplifier, 4 Func, 500uV Offset-Max, CMOS, PDSO14

LMC6464BIMby Texas Instruments

Operational Amplifier, 4 Func, 500uV Offset-Max, CMOS, PDSO14

LMC6464AIMby Texas Instruments

Operational Amplifier, 4 Func, 500uV Offset-Max, CMOS, PDSO14

Why Look for Alternatives?

Finding alternatives for LMC6464BIM/NOPB is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating LMC6464BIM/NOPB replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

Can't Find What You Need?

Our sourcing team can help find compatible alternatives for LMC6464BIM/NOPB. Get expert recommendations within 24 hours.

Request Alternatives for LMC6464BIM/NOPB

FAQ

What is equivalent to LMC6464BIM/NOPB?

Known equivalents for LMC6464BIM/NOPB include LMC6464AIM/NOPB, LMC6464BIM, LMC6464AIM. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of LMC6464BIM/NOPB?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify LMC6464BIM/NOPB alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.