LMC6462BIN Texas Instruments Integrated Circuit (Dual-In-Line Packages) In Stock

Features • Typical values unless otherwise noted • Ultra low supply current; 20μA/amplifier • Specified characteristics at 3V and 5V • Rail-to-rail input common-mode voltage range • Rail-to-rail output swing – Within 10mV of rail, VS = 5V and RL = 25kΩ • Low input current: 150fA • Low input offset voltage: 0.25mV

OBSOLETEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
LMC6462BINDual-In-Line Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Dual-In-Line Packages
Pin Count
8
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of LMC6462BIN?

  • Integrated Circuit from Texas Instruments identified by manufacturer part number LMC6462BIN
  • Documented technical context includes 3V for engineering comparison
  • Package or mechanical reference recorded as Dual-In-Line Packages for footprint checks
  • Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
  • Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval

What is LMC6462BIN used for?

LMC6462BIN is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 3V.

What are the specifications of LMC6462BIN?

Pbfree CodeNo
YTEOL0
Amplifier TypeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.00001 µA
Bias Current-Max (IIB) @25C0.00001 µA
Common-mode Reject Ratio-Min62dB
Common-mode Reject Ratio-Nom85dB
Frequency CompensationYES
Input Offset Voltage-Max3700 µV
JESD-30 CodeR-PDIP-T8
JESD-609 Codee0
Low-BiasYES
Low-OffsetNO
MicropowerYES
Number of Functions2
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeDIP8,.3
Package ShapeRECTANGULAR
Package StyleIN-LINE
Packing MethodRAIL
PowerNO
Programmable PowerNO
Qualification StatusNot Qualified
Slew Rate-Min8000V/us
Slew Rate-Nom28000V/us
Supply Current-Max0.07mA
Supply Voltage Limit-Max16V
Supply Voltage-Nom (Vsup)5V
Surface MountNO
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN LEAD
Terminal FormTHROUGH-HOLE
Terminal Pitch2.54mm
Terminal PositionDUAL
Unity Gain BW-Nom50
WidebandNO
PackageDual-In-Line Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCNEAR99
HTS Code8542.33.00.01

Where can I find the LMC6462BIN datasheet?

LMC6462BIN Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for LMC6462BIN?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which design checks should buyers confirm before selecting LMC6462BIN?

Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 3V, which should be matched against the target circuit and sourcing documentation.

How does the recorded package information affect sourcing LMC6462BIN?

The recorded package reference is Dual-In-Line Packages, so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 3V in the engineering review so procurement does not substitute a part with mismatched limits.

When comparing alternates for LMC6462BIN, which parameters matter most?

Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 3V, any alternate should match that requirement before release.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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