LMC6001AIN/NOPBAlternatives & Equivalent Parts

About LMC6001AIN/NOPB

LMC6001AIN/NOPB is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Dual-In-Line Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

Specification Comparison

ParameterLMC6001AIN/NOPBSourceOPA210IDBVRLMC6001AINSN74LVC1G11DBVR
ManufacturerTexas InstrumentsTexas InstrumentsTexas InstrumentsTexas Instruments
Package TypeDual-In-Line PackagesSOT23 (5-Pin)SOT23 (6-Pin)
Pin Count856
Temperature Range-40.0°C ~ 85.0°C-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C
Price$1.8613$0.0566
Electrical Parameters
Pbfree CodeYesYesYes
YTEOL151515
Amplifier TypeOPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACKVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)2.5e-8 µA0.007 µA
Bias Current-Max (IIB) @25C2.5e-8 µA0.002 µA
Common-mode Reject Ratio-Min66 dB120 dB
Common-mode Reject Ratio-Nom83 dB140 dB
Frequency CompensationYESYES
Input Offset Current-Max (IIO)0.000001 µA0.002 µA
Input Offset Voltage-Max350 µV35 µV
JESD-30 CodeR-PDIP-T8R-PDSO-G5R-PDSO-G6
JESD-609 Codee4e4e4
Low-BiasYESNO
Low-OffsetNOYES
MicropowerYESNO
Neg Supply Voltage Limit-Max-8 V-20 V
Neg Supply Voltage-Nom (Vsup)-5 V-15 V
Number of Functions111
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeDIP8,.3TSOP5/6,.11,37TSOP6,.11,37
Package ShapeRECTANGULARRECTANGULARRECTANGULAR
Package StyleIN-LINESMALL OUTLINE, LOW PROFILE, SHRINK PITCHSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing MethodTUBETRTR
PowerNONO
Programmable PowerNONO
Qualification StatusNot QualifiedNot Qualified
Slew Rate-Min0.6 V/us
Slew Rate-Nom1.5 V/us6.4 V/us
Supply Current-Max0.85 mA2.5 mA
Supply Voltage Limit-Max8 V20 V
Supply Voltage-Nom (Vsup)5 V15 V3.3 V
Surface MountNOYESYES
TechnologyCMOSBIPOLARCMOS
Temperature GradeINDUSTRIALAUTOMOTIVEAUTOMOTIVE
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)Nickel/Palladium/Gold (Ni/Pd/Au)Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal FormTHROUGH-HOLEGULL WINGGULL WING
Terminal Pitch2.54 mm0.95 mm0.95 mm
Terminal PositionDUALDUALDUAL
Unity Gain BW-Nom130018000
Voltage Gain-Min100000501187
WidebandNONO
Peak Reflow Temperature (Cel)260260
Time@Peak Reflow Temperature-Max (s)3030
## OPA210IDBVR Alternates Showing resultsImage
FamilyLVC/LCX/Z
Load Capacitance (CL)50 pF
Logic IC TypeAND GATE
Max I(ol)0.032 A
Number of Inputs3
Output Characteristics3-STATE
Power Supply Current-Max (ICC)0.01 mA
Prop. Delay@Nom-Sup4.9 ns
Propagation Delay (tpd)17.2 ns
Schmitt TriggerNO
Supply Voltage-Max (Vsup)5.5 V
Supply Voltage-Min (Vsup)1.65 V
## SN74LVC1G11DBVR Alternates Showing resultsImage

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

Quick Links

LMC6001AINby Texas Instruments

Operational Amplifier, 1 Func, 700uV Offset-Max, CMOS, PDIP8

Why Look for Alternatives?

Finding alternatives for LMC6001AIN/NOPB is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating LMC6001AIN/NOPB replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to LMC6001AIN/NOPB?

Known equivalents for LMC6001AIN/NOPB include OPA210IDBVR, LMC6001AIN, SN74LVC1G11DBVR. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of LMC6001AIN/NOPB?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify LMC6001AIN/NOPB alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.