LM48557TL Texas Instruments Integrated Circuit (Other) In Stock
LM48557TL is a single-channel speaker driver IC with integrated volume control in a 16-ball very thin profile fine-pitch BGA package. It is designed for portable audio applications requiring compact form factor and low supply current. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- LM48557TL Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM48557TL?
- Single-channel speaker driver with integrated digital volume control reducing external component count in portable audio designs
- Very thin profile 16-ball fine-pitch BGA package measuring 4x4 mm for ultra-compact smartphone and wearable layouts
- Volume control circuit integration eliminating need for discrete potentiometer or external volume control IC
- Optimized for low-voltage single-supply mobile audio systems requiring minimal PCB footprint and bill of materials
What is LM48557TL used for?
The LM48557TL is targeted at smartphones, tablets, and portable Bluetooth speakers where a compact single-channel audio output with volume control is required. Its very thin 16-ball BGA footprint suits ultra-slim handheld devices where vertical board space is severely constrained. The integrated volume control circuit simplifies firmware-driven audio level management without discrete analog components.
What are the specifications of LM48557TL?
| Pbfree Code | No |
| YTEOL | 0 |
| Consumer IC Type | VOLUME CONTROL CIRCUIT |
| JESD-30 Code | S-PBGA-B16 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA16,4X4,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 4.5V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the LM48557TL datasheet?
LM48557TL Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM48557TL?
Compatible alternatives and drop-in replacements for LM48557TL:
Frequently Asked Questions
How compact is the LM48557TL package and how does it fit in ultra-slim portable audio products?
The LM48557TL uses a 16-ball very thin profile fine-pitch BGA measuring 4x4 mm with a 0.5 mm ball pitch, making it one of the smallest speaker driver packages available. This footprint is compatible with the tight board constraints of slim smartphones and wearables where the total PCB area allocated to the audio output stage may be under 20 mm².
Does the LM48557TL include volume control and how is audio level adjusted in a typical mobile system?
Yes, the LM48557TL integrates a digital volume control circuit, allowing the host processor to adjust audio output level via a control interface without a separate potentiometer or external volume IC. This integration reduces BOM cost and PCB area while enabling smooth, glitch-free volume transitions across typically 32 or more discrete steps.
How many output channels does the LM48557TL support and what speaker configurations are compatible?
The LM48557TL provides 1 output channel, designed to drive a single mono speaker load in smartphones, smart speakers, or hearing-aid style devices. For stereo applications, 2 devices would be required. The single-channel architecture keeps supply current and heat dissipation low, suitable for battery-powered systems targeting maximum runtime per charge.
For a new portable speaker design, how does the LM48557TL's BGA packaging affect PCB assembly requirements?
The 16-ball fine-pitch BGA with 0.5 mm pitch requires reflow soldering and precise stencil-printed solder paste, along with X-ray inspection to verify joint quality. Assembly tolerances are tighter than for leaded packages, but the 4x4 mm body size saves significant area over SOT or SOIC alternatives at equivalent channel count, justifying the process requirements in volume mobile production.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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