LM4840MH Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The LM4840MH is a dual-channel audio amplifier with volume control by Texas Instruments (National Semiconductor) in a 28-pin TSSOP package. Key specs: 65dB channel separation, bridged mode operation, and 2-channel audio processing. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 28
- Lifecycle
- OBSOLETE
- Datasheet
- LM4840MH Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-channel audio amplifier with 65dB channel separation ensures excellent stereo imaging and low crosstalk
- Bridged mode operation available for increased output power from a single supply voltage
- Integrated volume control circuit reduces external component count and simplifies audio system design
- 28-pin TSSOP package enables compact PCB integration for portable and consumer audio equipment
Applications
The LM4840MH is designed for consumer audio applications including portable speakers, stereo amplifiers, home entertainment systems, and multimedia PC audio boards requiring a compact integrated dual-channel amplifier with volume control. Its bridged mode capability and high channel separation make it equally suitable for car audio head units and set-top boxes where space-efficient stereo audio amplification is needed.
Specifications
| YTEOL | 0 |
| Additional Feature | BRIDGED MODE OPERATION 70 DB CHANNEL SEPARATION ALSO AVAILABLE; SEATED HT_TYP |
| Channel Separation | 65dB |
| Consumer IC Type | VOLUME CONTROL CIRCUIT |
| Harmonic Distortion | 10% |
| JESD-30 Code | R-PDSO-G28 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many audio channels does the LM4840MH support?
The LM4840MH supports 2 audio channels with 65dB channel separation, providing excellent stereo performance suitable for consumer audio products such as portable speakers, stereo receivers, and multimedia devices.
Does the LM4840MH support bridged mode operation?
Yes, the LM4840MH supports bridged mode operation, which effectively doubles the output voltage swing and increases output power compared to single-ended operation, making it ideal for applications requiring more audio output from a limited supply voltage.
What package is the LM4840MH available in?
The LM4840MH is housed in a 28-pin TSSOP package (JESD-30 code R-PDSO-G28), offering a compact surface-mount footprint well-suited for integration into portable and consumer audio PCB designs.
What is the total harmonic distortion of the LM4840MH?
The LM4840MH has a harmonic distortion specification of 10%, which is typical for cost-effective consumer audio amplifier ICs intended for portable and multimedia audio applications where maximum efficiency and integration are prioritized over audiophile performance.
What is the LM4840MH's integrated volume control feature?
The LM4840MH includes an integrated volume control circuit that allows digital or analog control of audio output level, reducing the need for external potentiometers or dedicated volume control ICs and simplifying overall audio system design.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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