LM41CIMT Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Texas Instruments LM41CIMT is a digital temperature sensor with serial output, ±1°C accuracy, 0°C to 85°C range, and 3.6 V max supply in a 14-pin TSSOP package. Suited for thermal management in servers and industrial equipment.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- OBSOLETE
- Datasheet
- LM41CIMT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM41CIMT?
- ±1°C measurement accuracy over 0°C to +85°C range with serial digital output for direct microcontroller interfacing
- 3.6 V maximum supply voltage in a compact 14-pin TSSOP package enabling use in low-voltage 3.3 V digital systems
- Integrated temperature-to-digital conversion eliminates external signal conditioning, reducing BOM and PCB area
What is LM41CIMT used for?
LM41CIMT is designed for thermal management and over-temperature protection in computer motherboards, server blades, and telecom line cards operating in 0°C to 85°C environments. Its serial digital output connects directly to system management bus interfaces, enabling firmware to read die temperature and activate cooling fans or throttle clock frequencies when thresholds are exceeded. The compact TSSOP-14 footprint makes it suitable for high-density PCB designs where space is at a premium.
What are the specifications of LM41CIMT?
| YTEOL | 0 |
| Analog IC - Other Type | ANALOG CIRCUIT |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e0 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Temperature Grade | OTHER |
| Terminal Finish | TIN LEAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.01 |
Where can I find the LM41CIMT datasheet?
LM41CIMT Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM41CIMT?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Over what temperature range does LM41CIMT maintain its ±1°C accuracy, and is that sufficient for server thermal shutdown logic?
LM41CIMT maintains ±1°C accuracy across its full operating range of 0°C to +85°C, which covers typical server inlet air temperatures. This precision allows firmware to trigger cooling responses at a safe margin below the CPU's maximum junction temperature, providing reliable thermal shutdown without false triggers caused by sensor error.
What supply voltage range does LM41CIMT require, and can it operate alongside 3.3 V logic without a level shifter?
LM41CIMT operates from a supply voltage up to 3.6 V maximum, making it natively compatible with 3.3 V logic rails found in FPGAs, microcontrollers, and system-management controllers. No level shifter or voltage translation circuit is needed, simplifying the schematic and saving at least 2 passive components per channel.
For a high-density PCB with multiple thermal monitoring points, how does the TSSOP-14 package of LM41CIMT help minimize board real estate?
The TSSOP-14 package measures approximately 5 mm x 4.4 mm with 0.65 mm lead pitch, occupying roughly 22 mm² of board area. Placing three LM41CIMT sensors consumes under 70 mm² total, compared to bulkier SO-8 or PDIP packages, enabling thermal monitoring at CPU, VRM, and ambient locations within a compact blade-server module.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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