LM3S9B96-IBZ80-C3 Texas Instruments Integrated Circuit (BGA) In Stock
LM3S9B96-IBZ80-C3 is a 32-bit ARM Cortex-M3 Stellaris microcontroller running at up to 80 MHz with integrated ADC and rich connectivity peripherals. It is housed in a 108-ball BGA package suited for industrial applications. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S9B96-IBZ80-C3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S9B96-IBZ80-C3?
- 32-bit ARM Cortex-M3 core at 80 MHz delivering up to 100 DMIPS for demanding real-time control and connectivity tasks
- Integrated multi-channel 10-bit ADC enabling direct analog sensor acquisition without external converter ICs
- Rich peripheral set including USB, Ethernet MAC/PHY, CAN, and multiple UART/SPI/I2C interfaces on a single die
- Industrial-grade temperature range with 108-ball BGA package for compact high-density embedded board designs
What is LM3S9B96-IBZ80-C3 used for?
The LM3S9B96-IBZ80-C3 is designed for industrial control systems, factory automation nodes, and networked embedded instruments requiring Ethernet connectivity combined with analog and digital I/O on a single chip. Its ARM Cortex-M3 core at 80 MHz provides sufficient processing power for real-time protocols and local data processing in energy management and building automation equipment. The integrated USB and CAN interfaces further extend its applicability in multi-protocol industrial communication architectures.
What are the specifications of LM3S9B96-IBZ80-C3?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | NO |
| Clock Frequency-Max | 80MHz |
| DAC Channels | NO |
| DMA Channels | NO |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 65 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 98304 |
| ROM (words) | 262144 |
| ROM Programmability | FLASH |
| Speed | 80MHz |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3.3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.25 |
Where can I find the LM3S9B96-IBZ80-C3 datasheet?
LM3S9B96-IBZ80-C3 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S9B96-IBZ80-C3?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How fast is the LM3S9B96-IBZ80-C3 and what real-time control tasks can it handle at 80 MHz?
The LM3S9B96-IBZ80-C3 runs its ARM Cortex-M3 core at up to 80 MHz, delivering approximately 100 DMIPS of compute performance. This is sufficient for PID motor control loops, Modbus RTU/TCP protocol stacks, USB device firmware, and simultaneous multi-channel sensor acquisition with the integrated 10-bit ADC, all within a single industrial microcontroller.
Which connectivity peripherals does the LM3S9B96-IBZ80-C3 integrate for industrial networking applications?
The LM3S9B96-IBZ80-C3 integrates an Ethernet MAC with on-chip PHY, a CAN 2.0 controller, USB full-speed host and device, multiple UARTs, SPI, and I2C interfaces. This integration allows a single device to serve as a multi-protocol industrial gateway connecting field sensors over CAN to an Ethernet backbone at 10/100 Mbps without external networking chips.
What analog measurement capability does the LM3S9B96-IBZ80-C3 provide through its integrated ADC?
The integrated ADC provides 10-bit resolution with multiple input channels, enabling direct digitization of analog sensor signals such as temperature, pressure, and current in industrial applications. Sampling at up to hundreds of kilo-samples per second, the ADC feeds the Cortex-M3 pipeline directly, avoiding external SPI or I2C ADC chips and their associated latency and component cost.
For a compact industrial controller PCB, how does the 108-ball BGA package of LM3S9B96-IBZ80-C3 compare to LQFP alternatives?
The 108-ball BGA has a smaller footprint than equivalent pin-count LQFP packages, freeing board area for surrounding power components and connectors. However, BGA assembly requires reflow soldering with controlled profiles and X-ray inspection. For designs where assembly simplicity is paramount, a compatible LQFP variant may be preferred, while the BGA suits volume production targeting maximum routing density at 0.8 mm or finer ball pitch.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“The anti-counterfeit verification gave us confidence we'd never had with other China suppliers.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit