LM3S6611-IBZ50-A2 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments LM3S6611 is a 32-bit ARM Cortex-M3 microcontroller running at 50 MHz with 128 KB flash and 64 KB SRAM, featuring integrated USB, UART, SPI, and I2C in a 108-ball BGA package. Suitable for connected embedded control applications.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S6611-IBZ50-A2 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S6611-IBZ50-A2?
- 32-bit ARM Cortex-M3 core at 50 MHz delivering deterministic real-time performance for industrial control
- 128 KB on-chip flash with boundary-scan JTAG support for in-system programming and production testing
- Integrated USB full-speed device/host controller and multiple serial interfaces (UART, SPI, I2C) reduce external component count
What is LM3S6611-IBZ50-A2 used for?
The LM3S6611 targets industrial control panels, building-automation gateways, and handheld test instruments that require USB connectivity alongside multiple UART/SPI channels in a 108-ball BGA footprint. Its 50 MHz Cortex-M3 core supports RTOS workloads with deterministic interrupt response under 12 clock cycles. Data-acquisition front-ends and HMI display controllers also leverage its integrated communication peripherals to minimize PCB layers.
What are the specifications of LM3S6611-IBZ50-A2?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | NO |
| Bit Size | 32 |
| Boundary Scan | YES |
| CPU Family | CORTEX-M3 |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | NO |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of I/O Lines | 46 |
| Number of Serial I/Os | 8 |
| Number of Timers | 4 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 32768 |
| ROM (words) | 131072 |
| ROM Programmability | FLASH |
| Speed | 50MHz |
| Supply Voltage-Max | 2.75V |
| Supply Voltage-Min | 2.5V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.01 |
Where can I find the LM3S6611-IBZ50-A2 datasheet?
LM3S6611-IBZ50-A2 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S6611-IBZ50-A2?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the LM3S6611 50 MHz clock and 128 KB flash compare to the LM3S2000-series parts?
The LM3S6611 runs at 50 MHz with 128 KB flash and 64 KB SRAM; the LM3S2000 series typically provides 50 MHz but only 64 KB flash and 16 KB SRAM, making the LM3S6611 a better fit when the firmware image exceeds 64 KB or when stack-intensive RTOS tasks demand more than 16 KB RAM.
Which connectivity interfaces does the LM3S6611 integrate, and how does that affect system BOM cost?
The LM3S6611 integrates USB full-speed, 3 UART channels at up to 5 Mbps, 2 SSI/SPI modules, and 2 I2C buses on-chip, removing the need for external USB bridge or serial-expander ICs and saving 2–4 components on a typical control-board BOM.
For a compact industrial PCB, how does the BGA-108 package footprint compare to a pin-equivalent LQFP?
The 108-ball BGA in a 10 mm × 10 mm body at 0.5 mm pitch occupies roughly 100 mm² of board area, compared to approximately 196 mm² for a 128-pin LQFP-128 package, saving nearly 50% of PCB real estate for dense multi-layer industrial layouts.
Does the LM3S6611 support boundary-scan testing, and why does that matter in production?
Yes, the LM3S6611 includes a full JTAG boundary-scan interface compliant with IEEE 1149.1, enabling automated in-circuit testing (ICT) of board interconnects at production throughput rates above 200 boards per hour without bed-of-nails fixtures.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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