LM3S6611-IBZ50-A2 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments LM3S6611 is a 32-bit ARM Cortex-M3 microcontroller running at 50 MHz with 128 KB flash and 64 KB SRAM, featuring integrated USB, UART, SPI, and I2C in a 108-ball BGA package. Suitable for connected embedded control applications.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S6611-IBZ50-A2 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit ARM Cortex-M3 core at 50 MHz delivering deterministic real-time performance for industrial control
- 128 KB on-chip flash with boundary-scan JTAG support for in-system programming and production testing
- Integrated USB full-speed device/host controller and multiple serial interfaces (UART, SPI, I2C) reduce external component count
Applications
The LM3S6611 targets industrial control panels, building-automation gateways, and handheld test instruments that require USB connectivity alongside multiple UART/SPI channels in a 108-ball BGA footprint. Its 50 MHz Cortex-M3 core supports RTOS workloads with deterministic interrupt response under 12 clock cycles. Data-acquisition front-ends and HMI display controllers also leverage its integrated communication peripherals to minimize PCB layers.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | NO |
| Bit Size | 32 |
| Boundary Scan | YES |
| CPU Family | CORTEX-M3 |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | NO |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of I/O Lines | 46 |
| Number of Serial I/Os | 8 |
| Number of Timers | 4 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 32768 |
| ROM (words) | 131072 |
| ROM Programmability | FLASH |
| Speed | 50MHz |
| Supply Voltage-Max | 2.75V |
| Supply Voltage-Min | 2.5V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the LM3S6611 50 MHz clock and 128 KB flash compare to the LM3S2000-series parts?
The LM3S6611 runs at 50 MHz with 128 KB flash and 64 KB SRAM; the LM3S2000 series typically provides 50 MHz but only 64 KB flash and 16 KB SRAM, making the LM3S6611 a better fit when the firmware image exceeds 64 KB or when stack-intensive RTOS tasks demand more than 16 KB RAM.
Which connectivity interfaces does the LM3S6611 integrate, and how does that affect system BOM cost?
The LM3S6611 integrates USB full-speed, 3 UART channels at up to 5 Mbps, 2 SSI/SPI modules, and 2 I2C buses on-chip, removing the need for external USB bridge or serial-expander ICs and saving 2–4 components on a typical control-board BOM.
For a compact industrial PCB, how does the BGA-108 package footprint compare to a pin-equivalent LQFP?
The 108-ball BGA in a 10 mm × 10 mm body at 0.5 mm pitch occupies roughly 100 mm² of board area, compared to approximately 196 mm² for a 128-pin LQFP-128 package, saving nearly 50% of PCB real estate for dense multi-layer industrial layouts.
Does the LM3S6611 support boundary-scan testing, and why does that matter in production?
Yes, the LM3S6611 includes a full JTAG boundary-scan interface compliant with IEEE 1149.1, enabling automated in-circuit testing (ICT) of board interconnects at production throughput rates above 200 boards per hour without bed-of-nails fixtures.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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