LM3S5P31-IBZ80-C3 Texas Instruments Integrated Circuit (BGA) In Stock
The LM3S5P31-IBZ80-C3 is a 32-bit ARM Cortex-M3 microcontroller from the Texas Instruments Stellaris family, running up to 16 MHz with 67 I/O lines, integrated ADC, and DMA support. Packaged in a 108-ball BGA, it targets industrial control, building automation, and IoT edge applications requiring reliable 32-bit performance in a compact footprint.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S5P31-IBZ80-C3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S5P31-IBZ80-C3?
- 32-bit ARM Cortex-M3 core running up to 16 MHz for deterministic embedded control
- 67 configurable I/O lines supporting GPIO, timers, and serial interfaces
- Integrated ADC for on-chip analog measurement without external converters
- DMA controller for efficient peripheral-to-memory data transfers
- 108-ball BGA package (S-PBGA-B108) for compact high-density PCB designs
- Pb-free construction with RoHS-compliant packaging
What is LM3S5P31-IBZ80-C3 used for?
The LM3S5P31-IBZ80-C3 is deployed in industrial automation, building management, and smart energy systems where a 32-bit Cortex-M3 core with extensive I/O is required in a space-efficient package. Its 67 I/O lines and integrated DMA support sensor fusion, multi-channel data logging, and real-time motor control at 16 MHz clock rates. The part also suits IoT gateway modules and embedded HMI controllers that need reliable 32-bit processing without the cost of a higher-performance device.
What are the specifications of LM3S5P31-IBZ80-C3?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Clock Frequency-Max | 16MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 67 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Qualification Status | Not Qualified |
| ROM Programmability | FLASH |
| Speed | 80MHz |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Where can I find the LM3S5P31-IBZ80-C3 datasheet?
LM3S5P31-IBZ80-C3 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S5P31-IBZ80-C3?
Compatible alternatives and drop-in replacements for LM3S5P31-IBZ80-C3:
Frequently Asked Questions
How does 16 MHz clock speed of LM3S5P31-IBZ80-C3 compare to needs of real-time industrial control loops?
At 16 MHz, the LM3S5P31-IBZ80-C3 executes up to 16 million 32-bit ARM Cortex-M3 instructions per second, sufficient for PID control loops running at 10 kHz update rates with hundreds of clock cycles to spare per iteration. For applications requiring faster 100 kHz loops or floating-point DSP, designers should evaluate higher-speed Stellaris or Tiva C variants clocked at 80 MHz or above.
With 67 I/O lines in an LM3S5P31-IBZ80-C3 design, what peripheral mix can a building automation controller support?
The 67 I/O lines of LM3S5P31-IBZ80-C3 can simultaneously support multiple UART, SPI, and I2C interfaces, several PWM outputs for actuator control, digital inputs for relay monitoring, and ADC channels for temperature or occupancy sensor sampling — all within a single 32-bit MCU. This high I/O count reduces the need for I/O expanders in building management units controlling lighting, HVAC, and access control.
What are the BGA assembly considerations for the 108-ball S-PBGA-B108 package of this MCU?
The 108-ball BGA package of LM3S5P31-IBZ80-C3 requires reflow soldering with X-ray inspection for solder joint verification, as all connections are hidden under the device body. Typical ball pitch is 0.8 mm, requiring PCB pad diameters around 0.4 mm to 0.5 mm and at least 4-layer routing for signal integrity and power delivery. BGA rework is possible with specialized infrared or hot-air reballing equipment.
How does the DMA controller in LM3S5P31-IBZ80-C3 improve data throughput without taxing the CPU?
The integrated DMA controller allows LM3S5P31-IBZ80-C3 to transfer data between peripherals such as ADC, UART, and SPI and SRAM memory independently of the Cortex-M3 core. In a typical sensor acquisition scenario, DMA can move 16 ADC samples to a buffer while the CPU executes control algorithm code, reducing CPU loading by up to 80% for high-sample-rate data collection at 16 MHz.
Is LM3S5P31-IBZ80-C3 still in active production, and what lifecycle risk should designers consider?
The YTEOL value of 0 indicates this Stellaris part may be at or near end of its product lifecycle with Texas Instruments. Designers starting new projects should evaluate Tiva C Series TM4C123 or TM4C129 devices, which offer pin-compatible ARM Cortex-M4F cores at 80 MHz or 120 MHz with longer supply continuity. Existing designs using LM3S5P31-IBZ80-C3 should plan last-time-buy inventory covering 5 to 10 years of production.
Related Guides
STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply
Choose the right STM32H725 variant by comparing Flash, package, pin count, temperature grade, connectivity, and production requirements.
Aug 1, 2026
STM32H725IGT3 High-Performance MCU Design Guide
Design STM32H725IGT3 systems for reliable 550 MHz operation with practical power, clock, cache, DMA, PCB, ADC, and recovery guidance.
Jul 31, 2026
150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing
Select the 150141VS73100 by wavelength, brightness, drive current, 3528 fit, reliability, and traceable sourcing requirements.
Jul 31, 2026
STEF05SGR 5 V eFuse Protection Design Guide
Design a reliable 5 V STEF05SGR eFuse stage with current-limit math, capacitor sizing, thermal analysis, fault recovery, and PCB layout guidance.
Jul 30, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“The anti-counterfeit verification gave us confidence we'd never had with other China suppliers.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit