LM3S1P51-IBZ80-C3T Texas Instruments Integrated Circuit (BGA) In Stock

The LM3S1P51-IBZ80-C3T is a 32-bit ARM Cortex-M3 microcontroller operating at up to 16 MHz with integrated ADC, DMA, and multiple communication peripherals in a 108-ball NFBGA package. It delivers capable embedded processing for industrial and consumer control applications requiring a compact BGA form factor. Available from authorized distributors with worldwide shipping for volume and prototype quantities.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
LM3S1P51-IBZ80-C3TBGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
100
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of LM3S1P51-IBZ80-C3T?

  • 32-bit ARM Cortex-M3 core at up to 16 MHz providing deterministic real-time processing for embedded control and communication applications
  • Integrated ADC and DMA channels enabling direct analog data acquisition and memory transfers without CPU intervention for efficient data throughput
  • Compact 108-ball NFBGA package reducing PCB footprint versus LQFP alternatives for space-constrained industrial and consumer embedded designs

What is LM3S1P51-IBZ80-C3T used for?

The LM3S1P51-IBZ80-C3T suits industrial motor controllers, smart home gateway modules, and building automation panels where a 32-bit Cortex-M3 at 16 MHz provides ample processing for real-time control loops and protocol stacks. Its integrated ADC and DMA also make it effective in data logging instruments, medical monitoring devices, and factory sensor nodes requiring reliable, low-latency analog sampling.

What are the specifications of LM3S1P51-IBZ80-C3T?

Pbfree CodeYes
YTEOL0
Has ADCYES
Bit Size32
Boundary ScanNO
CPU FamilyCORTEX-M3
Clock Frequency-Max16MHz
DAC ChannelsNO
DMA ChannelsYES
JESD-30 CodeS-PBGA-B48
Number of I/O Lines67
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA108,12X12,32
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)NOT SPECIFIED
Qualification StatusNot Qualified
RAM (bytes)24576
ROM (words)65536
ROM ProgrammabilityFLASH
Speed80MHz
Supply Voltage-Max3.6V
Supply Voltage-Min3.3V
Supply Voltage-Nom3.3V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormBALL
Terminal Pitch0.8mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
HTS Code8542.31.00.25

Where can I find the LM3S1P51-IBZ80-C3T datasheet?

LM3S1P51-IBZ80-C3T Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for LM3S1P51-IBZ80-C3T?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the maximum CPU clock frequency of the LM3S1P51-IBZ80-C3T and how does it affect real-time control performance?

The LM3S1P51-IBZ80-C3T runs its ARM Cortex-M3 core at up to 16 MHz, yielding approximately 16 MIPS throughput, which supports control loop update rates of 10 kHz to 100 kHz in motor drive and PID controller applications while still handling UART, SPI, and I2C peripheral communications in the same execution context.

How does the integrated DMA in the LM3S1P51-IBZ80-C3T reduce CPU load during ADC data collection?

The DMA channels in the LM3S1P51-IBZ80-C3T transfer ADC conversion results directly to SRAM without CPU intervention, allowing the 16 MHz Cortex-M3 core to execute control algorithms while ADC samples at rates up to several hundred kilosamples per second are buffered automatically, reducing interrupt latency and enabling higher-resolution data logging.

What package does the LM3S1P51-IBZ80-C3T use and what are the PCB design implications?

The LM3S1P51-IBZ80-C3T uses a 108-ball NFBGA package with a small body pitch requiring 4-layer or 6-layer PCB stackup for signal routing and via fanout; this enables a board footprint roughly 40% smaller than an equivalent LQFP-100 package, making it suitable for compact industrial control modules and handheld instruments where board area is constrained.

Which communication interfaces are available on the LM3S1P51-IBZ80-C3T for connecting to sensors and networks?

The LM3S1P51-IBZ80-C3T integrates multiple serial peripherals including UART, SSI (SPI-compatible), and I2C interfaces, allowing simultaneous connection to environmental sensors over I2C, high-speed peripherals over SSI at up to 16 MHz bit rate, and host systems or debug ports over UART, covering the full range of embedded communication requirements without external bridge chips.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Rajesh Patel
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