LM3S1N11-IBZ50-C5T Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments LM3S1N11-IBZ50-C5T is a 32-bit ARM Cortex-M3 Stellaris microcontroller running up to 16.384 MHz with integrated ADC and DMA in a 100-pin BGA package. It delivers efficient embedded control performance for industrial and connected applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S1N11-IBZ50-C5T Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S1N11-IBZ50-C5T?
- 32-bit ARM Cortex-M3 core at up to 16.384 MHz delivers deterministic real-time control with Thumb-2 instruction set for code-density efficiency in embedded applications
- Integrated multi-channel ADC and DMA controller enable autonomous data acquisition without CPU intervention, freeing processing cycles for control algorithms
- 100-pin BGA package provides a high I/O density footprint suitable for complex boards requiring multiple communication interfaces, timers, and GPIO banks
- Stellaris peripheral integration including UART, SPI, I2C, and timers reduces external component count for complete embedded system designs
What is LM3S1N11-IBZ50-C5T used for?
The LM3S1N11-IBZ50-C5T is suited for industrial control units, building automation gateways, and motor drive systems that require a 32-bit Cortex-M3 processor with integrated peripherals in a high-density BGA package. Factory automation equipment, smart energy meters, and HVAC controllers benefit from its DMA-assisted ADC acquisition and rich peripheral set, which reduce software overhead for real-time data processing. Embedded networking modules and protocol bridges also leverage its multiple communication interfaces for simultaneous UART, SPI, and I2C data transfer in industrial IoT edge devices.
What are the specifications of LM3S1N11-IBZ50-C5T?
| Pbfree Code | No |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | NO |
| CPU Family | CORTEX-M3 |
| Clock Frequency-Max | 16.384MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PQFP-G100 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 67 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 12288 |
| ROM (words) | 65536 |
| ROM Programmability | FLASH |
| Speed | 50MHz |
| Supply Voltage-Max | 1.365V |
| Supply Voltage-Min | 1.3V |
| Supply Voltage-Nom | 1.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Where can I find the LM3S1N11-IBZ50-C5T datasheet?
LM3S1N11-IBZ50-C5T Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S1N11-IBZ50-C5T?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum CPU clock speed of the LM3S1N11-IBZ50-C5T and how does it compare to typical Cortex-M3 designs?
The LM3S1N11-IBZ50-C5T runs its Cortex-M3 core at up to 16.384 MHz. While many Cortex-M3 microcontrollers in other families reach 72 MHz or higher, the 16.384 MHz ceiling of this Stellaris device is well suited for control loops, state machines, and communication tasks with response latencies in the 10 µs to 100 µs range.
How does the DMA controller in the LM3S1N11-IBZ50-C5T benefit ADC-based sensor acquisition?
The integrated DMA controller transfers ADC conversion results directly to SRAM without CPU intervention. This allows the Cortex-M3 core to execute control algorithms at 16.384 MHz while the DMA autonomously collects 32 or more samples per interrupt, reducing ISR overhead by approximately 80% compared to a CPU-polled ADC scheme.
Which industrial communication protocols does the LM3S1N11-IBZ50-C5T support natively through its on-chip peripherals?
The LM3S1N11-IBZ50-C5T includes on-chip UART, SPI (SSI), and I2C controllers, supporting RS-232, RS-485, Modbus-RTU, and SMBus protocols. These interfaces cover most industrial sensor and actuator communication needs at bit rates up to 3.125 Mbps for SPI and 400 kHz for I2C fast mode, without requiring external interface ICs.
How does the 100-pin BGA package affect PCB design choices for the LM3S1N11-IBZ50-C5T compared to QFP alternatives?
The 100-pin BGA occupies a smaller body footprint than a 100-pin QFP, but requires at least 4 PCB layers for signal and power routing beneath the device. Designers gain a more compact board at the cost of assembly complexity; BGA rework requires infrared or vapor-phase reflow equipment, whereas 100-pin QFP packages can be hand-soldered during prototyping.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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