LM3S1911-IBZ50-A2T Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments LM3S1911 is a 32-bit ARM Cortex-M3 microcontroller with 256KB Flash, operating at 50 MHz, in a 108-ball BGA package, featuring JTAG boundary scan and rich connectivity peripherals for industrial control.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S1911-IBZ50-A2T Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- ARM Cortex-M3 core at 50 MHz providing 32-bit processing with Thumb-2 instruction set for efficient code density
- 256KB Flash program memory with on-chip SRAM supporting complex firmware in industrial control and communications applications
- JTAG boundary scan support enabling in-system debugging and production board-level test automation
- 108-ball BGA package (10 mm x 10 mm) offering high I/O density in compact industrial PCB form factors
- Multiple UART, SSI, I2C, and GPIO peripherals enabling flexible multi-protocol sensor and actuator interfacing
Applications
The LM3S1911 is suited for 32-bit industrial control applications including motor controllers, building automation nodes, and industrial communications gateways requiring Cortex-M3 processing at 50 MHz. Its 256KB Flash supports complex real-time operating system firmware alongside application code, while JTAG boundary scan simplifies board-level production testing. The 108-ball BGA package enables high-density PCB designs with access to the full complement of GPIO and peripheral pins.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | NO |
| Bit Size | 32 |
| Boundary Scan | YES |
| CPU Family | CORTEX-M3 |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | NO |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of I/O Lines | 60 |
| Number of Serial I/Os | 6 |
| Number of Timers | 4 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 65536 |
| ROM (words) | 262144 |
| ROM Programmability | FLASH |
| Speed | 50MHz |
| Supply Voltage-Max | 2.75V |
| Supply Voltage-Min | 2.5V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What processor core and clock speed does the LM3S1911 use?
The LM3S1911 is built on an ARM Cortex-M3 core operating at up to 50 MHz, delivering 32-bit fixed-point processing with Thumb-2 instruction set compression. This combination provides efficient code execution for real-time control loops, communication protocol stacks, and state machine firmware common in industrial automation applications.
How much Flash memory does the LM3S1911 provide, and is it sufficient for RTOS-based firmware?
The LM3S1911 includes 256KB of Flash program memory, which comfortably accommodates a lightweight RTOS kernel such as FreeRTOS (approximately 10KB to 30KB) alongside application code totaling up to 200KB. This Flash capacity supports multi-task firmware architectures used in industrial controllers and communication gateways.
Does the LM3S1911 support JTAG debugging, and what production test capabilities does boundary scan enable?
Yes, the LM3S1911 includes JTAG boundary scan compliant with IEEE 1149.1, enabling both on-chip debug via standard JTAG probes and automated board-level interconnect testing. Boundary scan allows production test fixtures to verify solder joint integrity of all 108 BGA balls without physical probe access, reducing test cost for complex assemblies.
For a compact industrial controller PCB, how large is the LM3S1911 BGA package?
The LM3S1911 uses a 108-ball BGA package with a 10 mm x 10 mm body and 0.8 mm ball pitch, providing a dense footprint for 32-bit Cortex-M3 performance. This compact size allows integration alongside power management and communication ICs on PCBs targeting DIN-rail modules and embedded panel controllers with limited board real estate.
Which serial communication interfaces are available on the LM3S1911 for industrial sensor networks?
The LM3S1911 provides multiple UART ports supporting baud rates up to 115200 bps and beyond, SSI (SPI-compatible) interfaces, and I2C ports, enabling simultaneous connections to RS-232, RS-485, SPI sensors, and I2C peripheral devices. This multi-protocol capability supports industrial field bus adapters, sensor fusion nodes, and mixed-interface control panels within a single chip.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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