LM3S1751-IBZ50-A2 Texas Instruments Integrated Circuit (BGA) In Stock
LM3S1751-IBZ50-A2 by Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 128 KB Flash, integrated ADC, and on-chip peripherals in a 108-pin BGA package. It runs at up to 50 MHz and includes USB, SSI, UART, and I2C interfaces for embedded control applications. Available worldwide with fast shipping from authorized distributors.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S1751-IBZ50-A2 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit ARM Cortex-M3 core at up to 50 MHz with 128 KB Flash and hardware boundary scan for production test
- Integrated 10-bit ADC with multiple input channels for direct sensor interface without external converters
- Full-featured USB and multi-protocol serial support including SSI, UART, and I2C in a single 108-pin BGA
Applications
LM3S1751-IBZ50-A2 targets embedded control systems such as motor drives, building automation controllers, and handheld test instruments requiring a 32-bit processor with on-chip USB connectivity. Its 128 KB Flash provides sufficient code space for real-time operating systems and communication stacks in industrial IoT gateway designs. The 108-ball BGA package suits high-density PCBs where through-hole or large LQFP packages are impractical.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | YES |
| CPU Family | CORTEX-M3 |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | NO |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of I/O Lines | 56 |
| Number of Serial I/Os | 6 |
| Number of Timers | 4 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 65536 |
| ROM (words) | 131072 |
| ROM Programmability | FLASH |
| Speed | 50MHz |
| Supply Voltage-Max | 2.75V |
| Supply Voltage-Min | 2.5V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum clock frequency of LM3S1751-IBZ50-A2, and how much Flash memory does it include?
The LM3S1751-IBZ50-A2 operates at up to 50 MHz on its ARM Cortex-M3 core and includes 128 KB of on-chip Flash memory for program storage. This combination supports running a lightweight RTOS with a USB communication stack simultaneously, making it suitable for industrial data logging and motor control applications in the 108-pin BGA package.
Which communication interfaces are integrated in the LM3S1751-IBZ50-A2, and how do they compare to PIC32 devices in the same class?
LM3S1751-IBZ50-A2 integrates USB full-speed, SSI, multiple UART channels, and I2C interfaces on a 32-bit Cortex-M3 core at 50 MHz with 128 KB Flash, offering a comparable peripheral set to PIC32MX devices while using the ARM instruction set ecosystem with its broader toolchain support. The 108-pin BGA package allows finer pitch routing than PIC32 TQFP options for space-constrained control boards.
For a compact industrial controller PCB, what are the routing implications of the LM3S1751-IBZ50-A2 BGA package?
The LM3S1751-IBZ50-A2 108-pin BGA requires at least a 4-layer PCB with controlled-impedance vias and a pad pitch typically around 0.8 mm, enabling higher I/O density per square millimeter than equivalent LQFP-100 alternatives. Boundary scan support simplifies production testing of BGA solder joints, reducing the need for expensive X-ray inspection in volume manufacturing of industrial control boards.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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