LM3S1608-IBZ50-A2T Texas Instruments Integrated Circuit (BGA) In Stock
LM3S1608-IBZ50-A2T is a 32-bit ARM Cortex-M3 microcontroller from Texas Instruments with 128 KB flash, 52 I/O lines, on-chip ADC, and boundary scan support, operating at up to 8.192 MHz. Housed in a 108-ball BGA package and rated for industrial temperatures, it targets embedded control and sensor interface applications.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S1608-IBZ50-A2T Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $22.3469(MOQ 1000)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S1608-IBZ50-A2T?
- 32-bit ARM Cortex-M3 core at up to 8.192 MHz
- 128 KB on-chip flash program memory
- 52 general-purpose I/O lines
- On-chip ADC for analog signal acquisition
- Boundary scan (JTAG) for automated board test
- 108-ball PBGA package (S-PBGA-B108)
- Industrial temperature range operation
What is LM3S1608-IBZ50-A2T used for?
The LM3S1608-IBZ50-A2T serves industrial control panels, remote terminal units, and sensor-gateway designs where a compact 32-bit ARM Cortex-M3 MCU with 52 I/O lines and an integrated ADC reduces external analog front-end component count. Its industrial temperature rating ensures reliable operation in factory automation and building management systems exposed to wide thermal variations. The BGA form factor makes it suitable for high-density embedded boards where through-hole or LQFP placement is impractical.
What are the specifications of LM3S1608-IBZ50-A2T?
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 8.192MHz |
| DAC Channels | NO |
| DMA Channels | NO |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 52 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 32768 |
| ROM (words) | 131072 |
| ROM Programmability | FLASH |
| Speed | 50MHz |
| Supply Voltage-Max | 2.75V |
| Supply Voltage-Min | 2.5V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Where can I find the LM3S1608-IBZ50-A2T datasheet?
LM3S1608-IBZ50-A2T Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S1608-IBZ50-A2T?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How much flash memory and how many I/O lines does the LM3S1608-IBZ50-A2T offer?
The LM3S1608-IBZ50-A2T provides 128 KB of on-chip flash program memory and 52 general-purpose I/O lines, giving embedded designers ample program storage and peripheral connectivity for sensor-interface and control applications in a compact 108-ball BGA package.
Does the LM3S1608-IBZ50-A2T include boundary scan, and how does that benefit board-level testing?
Yes, the device supports JTAG boundary scan, enabling automated interconnect testing on assembled PCBs to quickly identify open or shorted nets without physical probe access, which is particularly valuable for densely routed 108-ball BGA boards in industrial production environments.
For which industrial sensor or control applications is the LM3S1608-IBZ50-A2T a strong match?
This MCU suits remote terminal units, building automation controllers, and industrial sensor gateways requiring a 32-bit ARM Cortex-M3 processor at 8.192 MHz with an on-chip ADC for direct analog sensor acquisition across 52 I/O channels under industrial temperature conditions.
What package does the LM3S1608-IBZ50-A2T use, and what assembly consideration should designers be aware of?
The device uses a 108-ball plastic BGA package (JESD-30 code S-PBGA-B108), which demands reflow soldering with controlled paste volume and X-ray or AOI inspection after assembly, unlike leaded packages; however, it delivers a significantly smaller PCB footprint than equivalent LQFP or DIP options for the same pin count.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1000+ | $22.3469 | $22346.94 |
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