LDECG4470KA0N00 Kemet In Stock
LDE, Film, Metallized PEN Stacked, Automotive Grade, 4.7 uF, 10%, 40 VAC, 50 VDC, 125°C, -55°C, 125°C, 0.8 % , 85.1 MOhms, 100 V/us, 1.2 g, 5040, 13mm, 10.4mm, 4.1mm, 1250, 104 Weeks
- Manufacturer
- Kemet
- Package
- —
- Lifecycle
- ACTIVE
- Datasheet
- LDECG4470KA0N00 Datasheet PDF
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LDECG4470KA0N00?
- Integrated Circuit from Kemet for production electronic assemblies
- PCB-mount package package information for PCB footprint planning
- Datasheet context includes 4.7 uF for engineering cross-checks
- Manufacturer or distributor datasheet URL available for technical verification
- Suitable for embedded systems, industrial electronics, communication equipment applications
What is LDECG4470KA0N00 used for?
LDECG4470KA0N00 is commonly used in embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing where designers need dependable integrated circuit behavior and manufacturer-traceable sourcing. It is appropriate for production BOM builds, repair demand, and alternate qualification workflows that compare package fit, lifecycle status, and parameters such as 4.7 uF.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the LDECG4470KA0N00 datasheet?
LDECG4470KA0N00 Datasheet DownloadOfficial datasheet from Kemet
What are equivalent replacements for LDECG4470KA0N00?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design use cases are a practical fit for LDECG4470KA0N00?
LDECG4470KA0N00 is a Integrated Circuit from Kemet suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 4.7 uF detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.
How should engineers check package compatibility for LDECG4470KA0N00 during layout review?
Use the PCB-mount package package information together with 4.7 uF when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.
What should procurement keep aligned when cross-referencing LDECG4470KA0N00 against alternates?
Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as 10%. Matching these details lowers substitution risk across 1 approved BOM.
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