LCMXO3LF-4300C-5BG256I Lattice Semiconductor Integrated Circuit (BGA) In Stock

The LCMXO3LF-4300C-5BG256I is a Lattice MachXO3LF FPGA with 4300 logic cells (LUTs), 206 I/O pins, and 125.9 MHz maximum clock frequency in a 256-ball BGA package. It operates at 3.3 V nominal supply and is optimized for control-plane and bridging applications. Available from authorized distributors with worldwide shipping.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
LCMXO3LF-4300C-5BG256IBGA
Quick Facts
Manufacturer
Lattice Semiconductor
Package
BGA
Pin Count
256
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 100.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 4300 logic cells (LUTs) with 540 CLBs for flexible digital logic implementation in a compact BGA-256 package
  • 206 I/O pins supporting both 3.3 V and multi-voltage I/O standards for seamless interface bridging
  • Up to 125.9 MHz maximum clock frequency enabling high-speed control and communication logic
  • Low-power MachXO3LF architecture with instant-on capability suitable for system management and bridging roles

Applications

The LCMXO3LF-4300C-5BG256I is ideal for system control, interface bridging, and glue logic applications in embedded computing, industrial automation, and communications equipment where 4300 logic cells and 206 I/O pins are needed. Its 3.3 V operation and 256-ball BGA footprint make it suitable for PCIe endpoint bridging, sensor interface aggregation, and low-latency control loops running at up to 125.9 MHz. The MachXO3LF family's instant-on feature is particularly valued in power sequencing and board management controller designs.

Specifications

YTEOL19
Additional FeatureALSO OPERATES AT 3.3 V NOMINAL SUPPLY
Clock Frequency-Max125.9MHz
JESD-30 CodeS-PBGA-B256
JESD-609 Codee1
Number of CLBs540
Number of Inputs206
Number of Logic Cells4300
Number of Outputs206
Organization540CLBS
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA256,16X16,32
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Supply Voltage-Max3.465V
Supply Voltage-Min2.375V
Supply Voltage-Nom2.5V
Surface MountYES
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALL
Terminal Pitch0.8mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCN3A991.D
HTS Code8542.39.00.01
Country of OriginMalaysia

Datasheet

LCMXO3LF-4300C-5BG256I Datasheet Download

Official datasheet from Lattice Semiconductor

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the logic capacity and maximum clock speed of the LCMXO3LF-4300C-5BG256I?

The LCMXO3LF-4300C-5BG256I contains 4300 logic cells organized as 540 CLBs and supports a maximum clock frequency of 125.9 MHz. With 206 input and 206 output pins available, it offers substantial I/O bandwidth for control-plane designs requiring both moderate logic density and high pin count in a 256-ball BGA footprint.

For a low-power interface bridging design, how does the LCMXO3LF-4300C-5BG256I operate regarding supply voltage and I/O flexibility?

The LCMXO3LF-4300C-5BG256I operates at a 3.3 V nominal supply voltage and also supports lower I/O voltage levels for multi-standard interfacing. With 206 I/O pins available in the BG256 package, designers can map multiple protocol buses — such as SPI, I2C, UART, or parallel data interfaces — simultaneously, making it effective for bridging between 1.8 V and 3.3 V logic domains.

When should a designer choose LCMXO3LF-4300C-5BG256I over a larger MachXO3 device for a board management controller?

The LCMXO3LF-4300C-5BG256I with 4300 logic cells is the right choice when the design requires fewer than 206 I/O signals and logic utilization stays below 80% of 4300 LUTs, avoiding over-provisioning a larger device. Its BG256 package keeps board area under 14 x 14 mm and its lower power consumption compared to larger MachXO3LF devices (with 6900 or 9400 LUTs) reduces thermal and cost overhead in management controller slots.

What package does the LCMXO3LF-4300C-5BG256I use and what are the key physical dimensions for PCB layout?

The LCMXO3LF-4300C-5BG256I uses a 256-ball plastic BGA package (JESD-30 code S-PBGA-B256) with a standard 1 mm ball pitch, resulting in a compact board footprint of approximately 17 x 17 mm. Designers should plan PCB via fanout for 256 BGA balls, typically requiring at least 4–6 routing layers to escape all signal, power, and ground balls efficiently.

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Lead Time3-7 business days
MOQFrom 1 piece
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OriginChina (Authorized)

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