LCMXO3LF-4300C-5BG256I Lattice Semiconductor Integrated Circuit (BGA) In Stock
The LCMXO3LF-4300C-5BG256I is a Lattice MachXO3LF FPGA with 4300 logic cells (LUTs), 206 I/O pins, and 125.9 MHz maximum clock frequency in a 256-ball BGA package. It operates at 3.3 V nominal supply and is optimized for control-plane and bridging applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Lattice Semiconductor
- Package
- BGA
- Pin Count
- 256
- Lifecycle
- ACTIVE
- Datasheet
- LCMXO3LF-4300C-5BG256I Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 4300 logic cells (LUTs) with 540 CLBs for flexible digital logic implementation in a compact BGA-256 package
- 206 I/O pins supporting both 3.3 V and multi-voltage I/O standards for seamless interface bridging
- Up to 125.9 MHz maximum clock frequency enabling high-speed control and communication logic
- Low-power MachXO3LF architecture with instant-on capability suitable for system management and bridging roles
Applications
The LCMXO3LF-4300C-5BG256I is ideal for system control, interface bridging, and glue logic applications in embedded computing, industrial automation, and communications equipment where 4300 logic cells and 206 I/O pins are needed. Its 3.3 V operation and 256-ball BGA footprint make it suitable for PCIe endpoint bridging, sensor interface aggregation, and low-latency control loops running at up to 125.9 MHz. The MachXO3LF family's instant-on feature is particularly valued in power sequencing and board management controller designs.
Specifications
| YTEOL | 19 |
| Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
| Clock Frequency-Max | 125.9MHz |
| JESD-30 Code | S-PBGA-B256 |
| JESD-609 Code | e1 |
| Number of CLBs | 540 |
| Number of Inputs | 206 |
| Number of Logic Cells | 4300 |
| Number of Outputs | 206 |
| Organization | 540CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA256,16X16,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Supply Voltage-Max | 3.465V |
| Supply Voltage-Min | 2.375V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.D |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the logic capacity and maximum clock speed of the LCMXO3LF-4300C-5BG256I?
The LCMXO3LF-4300C-5BG256I contains 4300 logic cells organized as 540 CLBs and supports a maximum clock frequency of 125.9 MHz. With 206 input and 206 output pins available, it offers substantial I/O bandwidth for control-plane designs requiring both moderate logic density and high pin count in a 256-ball BGA footprint.
For a low-power interface bridging design, how does the LCMXO3LF-4300C-5BG256I operate regarding supply voltage and I/O flexibility?
The LCMXO3LF-4300C-5BG256I operates at a 3.3 V nominal supply voltage and also supports lower I/O voltage levels for multi-standard interfacing. With 206 I/O pins available in the BG256 package, designers can map multiple protocol buses — such as SPI, I2C, UART, or parallel data interfaces — simultaneously, making it effective for bridging between 1.8 V and 3.3 V logic domains.
When should a designer choose LCMXO3LF-4300C-5BG256I over a larger MachXO3 device for a board management controller?
The LCMXO3LF-4300C-5BG256I with 4300 logic cells is the right choice when the design requires fewer than 206 I/O signals and logic utilization stays below 80% of 4300 LUTs, avoiding over-provisioning a larger device. Its BG256 package keeps board area under 14 x 14 mm and its lower power consumption compared to larger MachXO3LF devices (with 6900 or 9400 LUTs) reduces thermal and cost overhead in management controller slots.
What package does the LCMXO3LF-4300C-5BG256I use and what are the key physical dimensions for PCB layout?
The LCMXO3LF-4300C-5BG256I uses a 256-ball plastic BGA package (JESD-30 code S-PBGA-B256) with a standard 1 mm ball pitch, resulting in a compact board footprint of approximately 17 x 17 mm. Designers should plan PCB via fanout for 256 BGA balls, typically requiring at least 4–6 routing layers to escape all signal, power, and ground balls efficiently.
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