LCMXO2-1200HC-4MG132I Lattice Semiconductor Integrated Circuit (BGA) In Stock
LCMXO2-1200HC-4MG132I is a low-power MachXO2 FPGA with 1,280 logic cells and 104 I/O pins in a 132-ball BGA package. It operates up to 131 MHz and supports 3.3 V nominal supply with instant-on nonvolatile configuration. Suitable for board management, glue logic, protocol bridging, and low-density programmable logic applications.
- Manufacturer
- Lattice Semiconductor
- Package
- BGA
- Pin Count
- 132
- Lifecycle
- ACTIVE
- Datasheet
- LCMXO2-1200HC-4MG132I Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1,280 logic cells with 160 CLBs and up to 131 MHz clock for compact glue-logic designs
- Nonvolatile instant-on configuration eliminates external boot Flash and speeds system startup
- 104 I/O pins in a 132-ball BGA enabling dense interconnects in board-management applications
- 3.3 V nominal supply with low static power consumption ideal for always-on control paths
Applications
The LCMXO2-1200HC-4MG132I is ideal for board-management controllers, protocol bridges, and glue-logic replacement tasks in industrial, communications, and consumer electronics designs. Its nonvolatile instant-on architecture ensures reliable power-sequencing control from the moment the board receives power. The compact 132-ball BGA package fits naturally into space-constrained PCB layouts requiring up to 104 flexible I/O signals at 3.3 V.
Specifications
| Pbfree Code | Yes |
| YTEOL | 19 |
| Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
| Clock Frequency-Max | 131MHz |
| JESD-30 Code | S-PBGA-B132 |
| JESD-609 Code | e1 |
| Number of Inputs | 104 |
| Number of Logic Cells | 1280 |
| Number of Outputs | 104 |
| Organization | 160CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA132,14X14,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Packing Method | TRAY |
| Peak Reflow Temperature (Cel) | 250 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 3.465V |
| Supply Voltage-Min | 2.375V |
| Supply Voltage-Nom | 2.5V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Malaysia, Philippines, Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many logic cells and I/O pins does the LCMXO2-1200HC-4MG132I provide, and what density of glue logic can it replace?
The LCMXO2-1200HC-4MG132I contains 1,280 logic cells organized in 160 CLBs and provides 104 I/O pins. This density is sufficient to consolidate multiple 74-series glue logic ICs or small CPLD functions onto a single device, saving PCB area and reducing component count in board-management or protocol-adaptation designs.
What is the maximum operating frequency of the LCMXO2-1200HC-4MG132I and how does nonvolatile configuration benefit system startup?
The LCMXO2-1200HC-4MG132I supports a maximum clock frequency of 131 MHz and uses nonvolatile on-chip configuration memory, meaning it becomes operational within microseconds of power-up without waiting for an external SPI Flash boot sequence. This instant-on behavior is essential for power-sequencing controllers that must assert resets or enable signals within the first milliseconds after voltage rails rise.
Which supply voltage does the LCMXO2-1200HC-4MG132I use, and is it compatible with 3.3 V system buses?
The LCMXO2-1200HC-4MG132I operates from a 3.3 V nominal supply and its I/O banks are also compatible with 3.3 V logic levels, making it a direct fit for legacy or mixed-voltage PCBs that standardize on a 3.3 V system bus. This eliminates the need for level shifters when interfacing with 3.3 V microcontrollers, FPGAs, or SoCs.
For a space-constrained industrial PCB, how compact is the 132-ball BGA footprint of the LCMXO2-1200HC-4MG132I?
The LCMXO2-1200HC-4MG132I comes in a 132-ball BGA package with 0.5 mm ball pitch, resulting in a die area footprint of approximately 8 mm x 8 mm. This compact form factor, combined with 104 available I/O pins, makes it one of the more area-efficient low-density FPGA options for industrial board-management or signal-routing tasks.
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