LAN9360A-I/CQBT-100 Microchip Integrated Circuit (BGA) In Stock
Microchip LAN9360A-I/CQBT-100 is an AEC-Q100 qualified AVB endpoint controller supporting 7 audio-video bridging streams across 40 channels with integrated transmit and receive functions. Housed in a 100-pin TFBGA package, it targets automotive and industrial real-time Ethernet audio/video applications.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 100
- Lifecycle
- OBSOLETE
- Datasheet
- LAN9360A-I/CQBT-100 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LAN9360A-I/CQBT-100?
- AVB endpoint with 7 streams and 40 channels supports IEEE 802.1AS/Qav/Qat for deterministic real-time audio and video transport over 100BASE-TX Ethernet
- AEC-Q100 Grade 1 qualified for automotive-grade reliability in harsh temperature and vibration environments
- Compact 100-pin thin fine-pitch BGA (10 mm x 10 mm, 0.8 mm pitch) reduces board area while supporting full AVB endpoint functionality
What is LAN9360A-I/CQBT-100 used for?
The LAN9360A-I/CQBT-100 is designed for automotive infotainment, instrument cluster, and ADAS systems requiring deterministic AVB audio and video transport over standard 100 Mbps Ethernet. Its 7-stream, 40-channel AVB capability supports synchronized multi-zone audio routing and camera feeds within in-vehicle networks conforming to IEEE 802.1AS and Qav standards. AEC-Q100 qualification ensures reliable operation across the full automotive temperature range and under vibration conditions encountered in production vehicles.
What are the specifications of LAN9360A-I/CQBT-100?
| YTEOL | 0 |
| JESD-30 Code | S-PBGA-B100 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Number of Transceivers | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA100,10X10,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Screening Level | AEC-Q100 |
| Surface Mount | YES |
| Telecom IC Type | ETHERNET TRANSCEIVER |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.01 |
Where can I find the LAN9360A-I/CQBT-100 datasheet?
LAN9360A-I/CQBT-100 Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for LAN9360A-I/CQBT-100?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many AVB streams and channels does the LAN9360A-I/CQBT-100 support, and which IEEE standards does it implement?
The LAN9360A-I/CQBT-100 supports 7 AVB streams across 40 channels and implements IEEE 802.1AS for time synchronization, IEEE 802.1Qav for traffic shaping, and IEEE 802.1Qat for stream reservation. These standards enable deterministic latency below 2 ms for audio and video data over standard 100BASE-TX Ethernet links in automotive and industrial networks.
What automotive reliability qualification does the LAN9360A-I/CQBT-100 carry, and what does that mean for vehicle integration?
The LAN9360A-I/CQBT-100 is qualified to AEC-Q100 Grade 1, which certifies operation across a junction temperature range of -40°C to 125°C and validated resistance to automotive-grade vibration, humidity, and electrostatic discharge conditions. This qualification is mandatory for OEM integration into body control modules, infotainment ECUs, and ADAS processing units in production vehicles.
What package does the LAN9360A-I/CQBT-100 use, and how does it compare to similar AVB controllers in terms of board footprint?
The LAN9360A-I/CQBT-100 uses a 100-pin thin fine-pitch BGA package measuring 10 mm x 10 mm with 0.8 mm ball pitch, which occupies approximately 100 mm² of PCB area. Compared to 128-pin or 144-pin LQFP alternatives for similar AVB functionality, this BGA footprint offers a 30% to 40% reduction in package area, enabling more compact automotive and industrial PCB layouts.
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