LAN9360A-I/CQB-100 Microchip Integrated Circuit (BGA) In Stock
LAN9360A-I/CQB-100 is a Microchip automotive Ethernet controller supporting IEEE 1722, IEEE 802.1AS time-sensitive networking, AEC-Q100 qualified, in a 100-pin TFBGA package. From $12.00 in stock worldwide shipping.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 100
- Lifecycle
- OBSOLETE
- Datasheet
- LAN9360A-I/CQB-100 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LAN9360A-I/CQB-100?
- Supports IEEE 1722 Audio/Video Transport and IEEE 802.1AS precision time synchronization
- AEC-Q100 automotive qualification for reliable in-vehicle network deployment
- 100-pin TFBGA (10×10 mm) fine-pitch ball grid array package
- Single-transceiver design simplifies PCB integration in ECU designs
- IEEE 1733 RTP media clock recovery for audio/video streaming
- Plastic/epoxy package body meets automotive temperature and humidity requirements
What is LAN9360A-I/CQB-100 used for?
LAN9360A-I/CQB-100 is designed for automotive Ethernet applications such as in-vehicle infotainment head units, camera ECUs, and AVB/TSN network bridges that require microsecond-level timing synchronization. Its IEEE 802.1AS support enables deterministic latency for Advanced Driver Assistance Systems and audio-video bridging over 100BASE-T1 or 100BASE-TX links. AEC-Q100 qualification ensures it meets the reliability demands of passenger-car production environments across automotive temperature ranges.
What are the specifications of LAN9360A-I/CQB-100?
| YTEOL | 0 |
| JESD-30 Code | S-PBGA-B100 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Number of Transceivers | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA100,10X10,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Screening Level | AEC-Q100 |
| Surface Mount | YES |
| Telecom IC Type | ETHERNET TRANSCEIVER |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.01 |
Where can I find the LAN9360A-I/CQB-100 datasheet?
LAN9360A-I/CQB-100 Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for LAN9360A-I/CQB-100?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which IEEE standards does LAN9360A-I/CQB-100 implement, and how do they enable time-sensitive automotive audio-video networking?
The LAN9360A-I/CQB-100 implements IEEE 1722 for audio and video transport, IEEE 1733 for RTP media-clock recovery, and IEEE 802.1AS for precision time synchronization with sub-microsecond accuracy. Together these standards form the AVB/TSN stack needed to stream uncompressed audio or video between ECUs over standard 100 Mbit/s Ethernet with deterministic latency under 2 ms per network hop.
What automotive qualification level does LAN9360A-I/CQB-100 carry, and what does that mean for production vehicle programs?
The device is qualified to AEC-Q100 Grade, the industry-standard JEDEC automotive reliability qualification for ICs. AEC-Q100 qualification means the part has passed accelerated stress tests including temperature cycling from -40°C to +125°C, humidity bias, and electrostatic discharge testing, confirming suitability for use in production passenger-car ECUs with multi-year service-life requirements.
What package does LAN9360A-I/CQB-100 use and how does its 100-pin count affect PCB routing complexity?
The LAN9360A-I/CQB-100 is housed in a 100-pin TFBGA package measuring approximately 10 mm × 10 mm with fine-pitch ball spacing. The 100 pins demand at least 4-layer PCB routing to fan out all signal, power, and ground connections, and the thin fine-pitch BGA profile requires a reflow oven with precise temperature profiling. Compared to a LQFP-100, the BGA saves roughly 50% board area for the same pin count.
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