L3GD20Alternatives & Equivalent Parts
About L3GD20
L3GD20 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Quad Flat No-Lead package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | L3GD20Source | CRCW0805100KJNEA | STM32F101C6T6 | STM32F407VGT6TR | BLUENRG-355AT | L3GD20H | L3GD20HTR | L3G4200D |
|---|---|---|---|---|---|---|---|---|
| Manufacturer | STMicroelectronics | Vishay | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package Type | Quad Flat No-Lead | Resistor Chip | Quad Flat Packages | Quad Flat Packages | Quad Flat No-Lead | Other | Other | Other |
| Pin Count | 16 | 2 | 48 | 100 | 33 | 16 | 16 | 16 |
| Temperature Range | -40.0°C ~ 85.0°C | -55.0°C ~ 155.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 105.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C |
| Price | $3.0150 | $0.0019 | $3.1447 | $6.8570 | $2.9326 | — | $3.1500 | $6.1088 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | OBSOLETE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | OBSOLETE | OBSOLETE | OBSOLETE |
| Electrical Parameters | ||||||||
| YTEOL | 0 | 12 | 8.22 | 9 | 8 | 0 | 0 | 0 |
| Analog IC - Other Type | ANALOG CIRCUIT | — | — | — | — | ANALOG CIRCUIT | ANALOG CIRCUIT | MOTION SENSOR |
| JESD-30 Code | S-PBGA-BU16 | — | S-PQFP-G48 | S-PQFP-G100 | S-PQCC-N32 | S-PBGA-BU16 | S-PBGA-BU16 | S-PBGA-BU16 |
| Number of Functions | 1 | — | — | — | — | 1 | 1 | 1 |
| Package Body Material | PLASTIC/EPOXY | — | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | LCC16,.16SQ,25 | — | QFP48,.35SQ,20 | QFP100,.63SQ,20 | LCC32,.2SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LGA16,4X4,26 |
| Package Shape | SQUARE | — | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMT | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Qualification Status | Not Qualified | — | Not Qualified | Not Qualified | — | Not Qualified | Not Qualified | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6 V | — | — | — | — | 3.6 V | 3.6 V | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.4 V | — | — | — | — | 2.2 V | 2.2 V | 2.4 V |
| Supply Voltage-Nom (Vsup) | 3 V | — | — | — | — | 3 V | 3 V | 3 V |
| Surface Mount | YES | YES | YES | YES | YES | YES | YES | YES |
| Technology | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | — | INDUSTRIAL | INDUSTRIAL | — | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal Form | BUTT | — | GULL WING | GULL WING | NO LEAD | BUTT | BUTT | BUTT |
| Terminal Pitch | 0.65 mm | — | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm |
| Terminal Position | BOTTOM | — | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM |
| ## L3GD20 Alternates Showing results | Image | — | — | — | — | — | — | — |
| Pbfree Code | — | Yes | — | — | — | — | — | — |
| Reach Compliance Code | — | Compliant | — | — | — | — | — | — |
| Additional Feature | — | RATED AC VOLTAGE (V): 150 | — | — | — | — | — | — |
| Construction | — | Rectangular | — | — | — | — | — | — |
| Mounting Feature | — | SURFACE MOUNT | — | — | — | — | — | — |
| Package Height | — | 0.5 mm | — | — | — | — | — | — |
| Package Length | — | 2 mm | — | — | — | — | — | — |
| Package Width | — | 1.25 mm | — | — | — | — | — | — |
| Packing Method | — | TR, Paper, 7 Inch | — | — | — | — | — | — |
| Rated Power Dissipation (P) | — | 0.125 W | — | — | — | — | — | — |
| Rated Temperature | — | 70 °C | — | — | — | — | — | — |
| Reference Standard | — | AEC-Q200 | — | — | — | — | — | — |
| Resistance | — | 100000 Ω | — | — | — | — | — | — |
| Resistor Type | — | FIXED RESISTOR | — | — | — | — | — | — |
| Size Code | — | 0805 | — | — | — | — | — | — |
| Temperature Coefficient | — | 200 ppm/°C | — | — | — | — | — | — |
| Terminal Finish | — | Matte Tin (Sn) - with Nickel (Ni) barrier | MATTE TIN | Matte Tin (Sn) | — | Nickel/Gold (Ni/Au) - electrolytic | NICKEL GOLD | Nickel/Gold (Ni/Au) - electrolytic |
| Terminal Shape | — | WRAPAROUND | — | — | — | — | — | — |
| Tolerance | — | 5% | — | — | — | — | — | — |
| Working Voltage | — | 150 V | — | — | — | — | — | — |
| Has ADC | — | — | YES | YES | — | — | — | — |
| Bit Size | — | — | 32 | 32 | — | — | — | — |
| Boundary Scan | — | — | NO | YES | — | — | — | — |
| CPU Family | — | — | CORTEX-M3 | CORTEX-M4 | — | — | — | — |
| Clock Frequency-Max | — | — | 16 MHz | 26 MHz | — | — | — | — |
| DAC Channels | — | — | NO | YES | — | — | — | — |
| DMA Channels | — | — | YES | YES | — | — | — | — |
| JESD-609 Code | — | — | e3 | e3 | — | e4 | e4 | e4 |
| Number of I/O Lines | — | — | 37 | 82 | — | — | — | — |
| On Chip Program ROM Width | — | — | 8 | 8 | — | — | — | — |
| PWM Channels | — | — | YES | YES | — | — | — | — |
| RAM (bytes) | — | — | 6144 | 200704 | — | — | — | — |
| ROM (words) | — | — | 32768 | 1048576 | — | — | — | — |
| ROM Programmability | — | — | FLASH | FLASH | — | — | — | — |
| Speed | — | — | 36 MHz | 168 MHz | — | — | — | — |
| Supply Voltage-Max | — | — | 3.6 V | 3.6 V | 3.6 V | — | — | — |
| Supply Voltage-Min | — | — | 3.3 V | 3.3 V | 1.7 V | — | — | — |
| Supply Voltage-Nom | — | — | 3.3 V | 3.3 V | 1.8 V | — | — | — |
| uPs/uCs/Peripheral ICs Type | — | — | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | RFSoC | — | — | — |
| ## STM32F101C6T6 Alternates Showing results | — | — | Image | — | — | — | — | — |
| Factory Lead Time | — | — | — | 15 Weeks | 15 Weeks | — | — | — |
| Address Bus Width | — | — | — | 8 | — | — | — | — |
| External Data Bus Width | — | — | — | 16 | — | — | — | — |
| Format | — | — | — | FLOATING POINT | — | — | — | — |
| Integrated Cache | — | — | — | NO | — | — | — | — |
| Low Power Mode | — | — | — | YES | — | — | — | — |
| Number of DMA Channels | — | — | — | 2 | — | — | — | — |
| Number of External Interrupts | — | — | — | 16 | — | — | — | — |
| Peak Reflow Temperature (Cel) | — | — | — | 260 | — | 260 | 260 | 260 |
| Supply Current-Max | — | — | — | 102 mA | — | — | — | — |
| Time@Peak Reflow Temperature-Max (s) | — | — | — | 30 | — | 30 | 30 | 30 |
| Date Of Intro | — | — | — | — | 2020-07-16 | — | — | — |
| ## L3GD20HTR Alternates Showing results | — | — | — | — | — | — | Image | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Why Look for Alternatives?
Finding alternatives for L3GD20 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating L3GD20 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to L3GD20?
Known equivalents for L3GD20 include CRCW0805100KJNEA, STM32F101C6T6, STM32F407VGT6TR. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of L3GD20?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify L3GD20 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.