ISO1H811GAlternatives & Equivalent Parts
About ISO1H811G
ISO1H811G is a Integrated Circuit component manufactured by Infineon. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | ISO1H811GSource | ISO1I811T | ISO1I811TXUMA1 | BC846BDW1T1G | BC857B-7-F |
|---|---|---|---|---|---|
| Manufacturer | Infineon | Infineon | Infineon | ON Semiconductor | Diodes Inc. |
| Package Type | Small Outline Packages | Small Outline Packages | Small Outline Packages | SOT23 (6-Pin) | SOT23 (3-Pin) |
| Pin Count | 36 | 48 | 48 | 6 | 3 |
| Temperature Range | -25.0°C ~ 125.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -55.0°C ~ 150.0°C | ~ 150.0°C |
| Price | $5.0600 | $3.1700 | $3.1000 | $0.0187 | $0.0263 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||
| Pbfree Code | Yes | — | — | Yes | Yes |
| YTEOL | 7.15 | — | — | 7 | 7 |
| Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | — | — | — | — |
| Driver Number of Bits | 8 | — | — | — | — |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | DIGITAL I/P MODULE | DIGITAL I/P MODULE | — | — |
| JESD-30 Code | R-PDSO-G36 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G6 | R-PDSO-G3 |
| JESD-609 Code | e3 | — | e3 | e3 | e3 |
| Number of Functions | 1 | 1 | 1 | — | — |
| Output Current Flow Direction | SINK | — | — | — | — |
| Output Current-Max | 0.625 A | — | — | — | — |
| Output Peak Current Limit-Nom | 0.7 A | — | — | — | — |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | SSOP36,.56 | TSSOP48,.3,20 | TSSOP48,.3,20 | — | — |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED | — | 260 | 260 |
| Qualification Status | Not Qualified | — | — | Not Qualified | Not Qualified |
| Supply Current-Max | 6 mA | — | — | — | — |
| Supply Voltage-Max | 5.5 V | 5.5 V | 5.5 V | — | — |
| Supply Voltage-Min | 3 V | 2.85 V | 2.85 V | — | — |
| Supply Voltage-Nom | 3.3 V | 3.3 V | 3.3 V | — | — |
| Supply Voltage1-Max | 30 V | 35 V | 35 V | — | — |
| Supply Voltage1-Min | 15 V | 9.6 V | 9.6 V | — | — |
| Surface Mount | YES | YES | YES | YES | YES |
| Temperature Grade | OTHER | INDUSTRIAL | INDUSTRIAL | — | — |
| Terminal Finish | Tin (Sn) | — | Tin (Sn) | Matte Tin (Sn) - annealed | MATTE TIN |
| Terminal Form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 0.5 mm | 0.5 mm | — | — |
| Terminal Position | DUAL | DUAL | DUAL | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED | — | 30 | 30 |
| Turn-off Time | 170 µs | — | — | — | — |
| Turn-on Time | 120 µs | — | — | — | — |
| Factory Lead Time | — | 17 Weeks, 5 Days | — | — | 12 Weeks |
| Supply Voltage1-Nom | — | 24 V | 24 V | — | — |
| Manufacturer Package Code | — | — | — | 419B-02 | — |
| Collector Current-Max (IC) | — | — | — | 0.1 A | 0.1 A |
| Collector-Emitter Voltage-Max | — | — | — | 65 V | 45 V |
| Configuration | — | — | — | SEPARATE, 2 ELEMENTS | SINGLE |
| DC Current Gain-Min (hFE) | — | — | — | 200 | 220 |
| Number of Elements | — | — | — | 2 | 1 |
| Polarity/Channel Type | — | — | — | NPN | PNP |
| Power Dissipation-Max (Abs) | — | — | — | 0.38 W | 0.3 W |
| Transistor Application | — | — | — | AMPLIFIER | SWITCHING |
| Transistor Element Material | — | — | — | SILICON | SILICON |
| Transition Frequency-Nom (fT) | — | — | — | 100 MHz | 200 MHz |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Quick Links
Why Look for Alternatives?
Finding alternatives for ISO1H811G is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating ISO1H811G replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to ISO1H811G?
Known equivalents for ISO1H811G include ISO1I811T, ISO1I811TXUMA1, BC846BDW1T1G. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of ISO1H811G?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify ISO1H811G alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.