IS2023S-002-TRAY Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
IS2023S-002-TRAY is a Bluetooth v4.1 stereo headset SoC with integrated audio DSP from Microchip, running on a 1.2 V core supply. It integrates advanced audio processing in a 56-pin QFN package and enables premium wireless headphone and earphone product designs.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 57
- Lifecycle
- ACTIVE
- Datasheet
- IS2023S-002-TRAY Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -20.0°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of IS2023S-002-TRAY?
- Bluetooth v4.1 stereo audio connectivity for wireless headsets
- Integrated audio DSP for noise cancellation and equalizer processing
- 1.2 V nominal core supply voltage for ultra-low power operation
- 56-pin XQCC (QFN) package with thermal heat-slug for compact assembly
- CMOS process technology for low standby and active power
- Tray packaging option for high-volume automated SMT production
What is IS2023S-002-TRAY used for?
The IS2023S-002-TRAY targets premium Bluetooth stereo headsets, true wireless earbuds, and headphones requiring on-chip DSP for features such as active noise cancellation, bass enhancement, and voice-prompt playback. Its Bluetooth v4.1 stack and audio DSP integration reduce the external component count significantly, enabling slimmer product designs with fewer PCBs. Consumer electronics manufacturers and OEM audio brands use it as the core SoC for headphone products requiring low latency, high-quality stereo audio, and multipoint connection.
What are the specifications of IS2023S-002-TRAY?
| JESD-30 Code | S-XQCC-N56 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | LCC56,.27SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Max | 1.26V |
| Supply Voltage-Min | 1.14V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | RFSoC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8517.70.00.00 |
| Country of Origin | Thailand |
Where can I find the IS2023S-002-TRAY datasheet?
IS2023S-002-TRAY Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for IS2023S-002-TRAY?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What Bluetooth version does the IS2023S-002-TRAY support, and how does that affect headset audio quality?
The IS2023S-002-TRAY supports Bluetooth v4.1, which includes enhanced data rate profiles and improved coexistence with Wi-Fi at 2.4 GHz. For stereo headsets this means stable A2DP streaming at up to 48 kHz sample rates and reliable AVRCP media control without audio dropouts in typical office or home RF environments.
How does the integrated audio DSP in the IS2023S-002-TRAY reduce external component requirements for a headphone design?
By embedding the DSP core on the same die as the Bluetooth radio, the IS2023S-002-TRAY eliminates the need for a separate audio DSP chip and its associated decoupling capacitors, oscillator, and I2S interface routing. A complete 1.2 V core supply and 56-pin QFN footprint allows the full Bluetooth audio signal chain — receive, decode, DSP, and analog output — to run from a single IC, cutting BOM cost and PCB area by roughly 30% to 40% versus a two-chip solution.
For true wireless earbud designs, what package and supply voltage considerations apply to the IS2023S-002-TRAY?
The IS2023S-002-TRAY uses a 56-pin XQCC QFN package measuring approximately 7 mm × 7 mm with an integrated heat-slug, enabling effective thermal management at 1.2 V nominal core operation. The low 1.14 V to 1.26 V supply range pairs naturally with a small-cell LiPo battery and a simple LDO, making it practical for the compact, weight-sensitive PCBs required in true wireless earbud stems where total PCB area may be under 200 mm².
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