IS2020S-203-TRAY Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
The IS2020S-203-TRAY is a Bluetooth v4.1 stereo headset SoC with integrated DSP from Microchip, housed in a 56-pin VQFN package with a supply voltage up to 1.26 V. It provides complete wireless audio and signal processing for consumer headset designs shipped in tray packaging.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Datasheet
- IS2020S-203-TRAY Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $3.3700(MOQ 100)
- Temp Range
- -20.0°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of IS2020S-203-TRAY?
- Bluetooth v4.1 stereo audio with integrated DSP eliminates external audio processing ICs
- Compact 56-pin VQFN package (0.27-inch square) supports space-constrained wearable and headset PCBs
- Supply voltage up to 1.26 V enables operation directly from single-cell Li-ion battery outputs
What is IS2020S-203-TRAY used for?
The IS2020S-203-TRAY is designed for Bluetooth stereo headsets, earbuds, and wireless headphones that require integrated DSP for audio enhancement such as noise reduction and equalization. It suits consumer wearable products requiring low-voltage Bluetooth v4.1 connectivity and high-quality stereo audio in a single compact IC.
What are the specifications of IS2020S-203-TRAY?
| Manufacturer Package Code | VQFN-56 |
| Factory Lead Time | 16Weeks |
| YTEOL | 13 |
| JESD-30 Code | S-XQCC-N56 |
| JESD-609 Code | e3 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | LCC56,.27SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Max | 1.26V |
| Supply Voltage-Min | 1.14V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | RFSoC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Taiwan |
Where can I find the IS2020S-203-TRAY datasheet?
IS2020S-203-TRAY Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for IS2020S-203-TRAY?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What Bluetooth version does the IS2020S support and how does it benefit headset battery life?
The IS2020S supports Bluetooth v4.1, which includes low-energy features that reduce power consumption compared to earlier versions. Operating from a supply voltage of up to 1.26 V, it is optimized for single-cell battery-powered headsets that require extended playback time between charges.
Which package does the IS2020S-203-TRAY come in and what are its physical dimensions?
The IS2020S-203-TRAY is housed in a 56-pin VQFN (Very Thin Quad Flat No-Lead) package with a 0.27-inch square body, enabling compact PCB layouts in wearable audio devices. The tray packaging format is suitable for automated SMT assembly in volume production.
For a true wireless stereo earbud design, how does IS2020S-203-TRAY compare to using a discrete Bluetooth plus DSP solution?
The IS2020S-203-TRAY integrates both Bluetooth v4.1 stereo audio and DSP functions into a single 56-pin VQFN IC operating at up to 1.26 V, reducing BOM count and board area versus separate radio and DSP chips. This integration lowers design complexity and can shorten time-to-market for earbud and headset products.
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About Microchip
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More from Microchip
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $3.8300 | $383.00 |
| 1000+ | $3.5300 | $3530.00 |
| 5000+ | $3.3700 | $16850.00 |
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