IRL40T209ATMA1 Infineon Transistor (Other) In Stock

The Infineon IRL40T209ATMA1 is a high-current N-channel power MOSFET rated at 40 V drain-source breakdown voltage and 300 A maximum drain current, featuring an ultra-low 0.72 mΩ on-resistance (RDS(on)) in an HSOF-8 package with integrated body diode. It delivers 875 mJ avalanche energy rating for robust switching in demanding power applications. This device is designed for automotive, industrial motor drives, and high-efficiency DC-DC converter applications.

OBSOLETETransistorVerified Jun 2026
Package / Visual Reference
IRL40T209ATMA1Other
Quick Facts
Manufacturer
Infineon
Package
Other
Pin Count
19
Lifecycle
OBSOLETE
Category
Transistor
Temp Range
-55.0°C to 175.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Ultra-low RDS(on) of 0.72 mΩ at 300 A drain current minimizes conduction losses in high-current power stages
  • 875 mJ avalanche energy rating provides robust protection against inductive switching transients in motor drive circuits
  • HSOF-8 package with drain-connected case enables direct heatsink mounting for superior thermal management at high current

Applications

The Infineon IRL40T209ATMA1 is used in high-current automotive motor control modules, electric vehicle DC-DC converters, and synchronous rectifier stages where very low RDS(on) at 300 A is critical for efficiency. Its HSOF-8 package with case-to-drain connection facilitates efficient heat dissipation when mounted to a heatsink, supporting continuous operation in thermally demanding under-hood environments. The device is also applied in industrial servo drives and UPS systems requiring reliable 40 V switching with high avalanche ruggedness.

Specifications

Factory Lead Time52Weeks
YTEOL0
Avalanche Energy Rating (Eas)875mJ
Case ConnectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min40V
Drain Current-Max (ID)300A
Drain-source On Resistance-Max0.00072Ω
FET TechnologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 CodeR-PSSO-F8
JESD-609 Codee3
Number of Elements1
Operating ModeENHANCEMENT MODE
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE
Peak Reflow Temperature (Cel)NOT SPECIFIED
Polarity/Channel TypeN-CHANNEL
Power Dissipation-Max (Abs)500W
Pulsed Drain Current-Max (IDM)1200A
Surface MountYES
Terminal FinishTin (Sn)
Terminal FormFLAT
Terminal PositionSINGLE
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Transistor ApplicationSWITCHING
Transistor Element MaterialSILICON
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCNEAR99
HTS Code8541.29.00.95

Datasheet

IRL40T209ATMA1 Datasheet Download

Official datasheet from Infineon

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the RDS(on) of the IRL40T209ATMA1 and why does it matter for a 300 A motor drive design?

The IRL40T209ATMA1 has a maximum drain-source on-resistance (RDS(on)) of 0.00072 Ω (0.72 mΩ). At 300 A drain current, this results in a conduction power loss of only about 64.8 W (I² × R = 300² × 0.00072), which is exceptionally low for a device at this current level. Minimizing RDS(on) is critical in motor drives and EV converters to limit thermal dissipation and improve overall system efficiency.

How does the IRL40T209ATMA1's avalanche energy rating protect circuits with inductive loads?

The IRL40T209ATMA1 is rated for 875 mJ of unclamped inductive switching (UIS) avalanche energy. When switching inductive loads such as motors or transformers, energy stored in the inductance can cause voltage spikes exceeding the drain-source breakdown voltage of 40 V. The high avalanche energy rating allows the MOSFET to safely absorb these transients without damage, increasing system reliability and reducing the need for external snubber circuits.

Which thermal management strategy should be used with the IRL40T209ATMA1 in a high-current application?

The IRL40T209ATMA1 uses an HSOF-8 package where the case is connected directly to the drain. This allows the device to be mounted directly to a grounded heatsink (with appropriate electrical isolation if needed), providing a low thermal resistance path from junction to ambient. At 300 A and 0.72 mΩ RDS(on), adequate heatsinking with thermal resistance below 0.5 °C/W is recommended to maintain junction temperature below 175 °C.

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pcs

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy