HTSW-103-07-T-S SAMTEC Connector (Header, Vertical) In Stock

SAMTEC HTSW-103-07-T-S is a 3-position single-row vertical PCB header with 0.100 inch pitch and matte tin over nickel male contacts. Compact and RoHS-compliant, it is ideal for board-to-board and board-to-wire connections in industrial, consumer, and embedded electronics applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
HTSW-103-07-T-SHeader, Vertical
Quick Facts
Manufacturer
SAMTEC
Package
Header, Vertical
Pin Count
3
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 105.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 3-position single-row vertical header on 0.100 inch (2.54 mm) pitch for compact PCB footprint
  • Matte tin over nickel contact finish provides reliable low-resistance connections with broad mating compatibility
  • RoHS-compliant construction for use in environmentally regulated products
  • Through-hole vertical mounting for strong solder joint retention in vibration-prone applications
  • Short 1-week lead time with availability for rapid prototyping and production schedules

Applications

The HTSW-103-07-T-S is used in development boards, embedded module interfaces, and compact sensor assemblies where a 3-pin right-angle or vertical 0.100 inch header provides straightforward signal or power connections. Its small form factor fits tightly spaced board layouts in handheld devices, IoT nodes, and industrial sensor hubs requiring reliable board-to-wire connectivity with standard mating socket housings. Engineers favor this part for prototyping and low-to-mid volume production runs due to its broad mating compatibility and short lead times.

Specifications

Pbfree CodeYes
Factory Lead Time1Week
YTEOL9.1
Body Breadth0.098inch
Body Depth0.1inch
Body Length0.3inch
Connector TypeBOARD CONNECTOR
Contact Finish MatingMATTE TIN OVER NICKEL (50)
Contact Finish TerminationMatte Tin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorNATURAL
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.1inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows1
Number of Rows Loaded1
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
Rated Current (Signal)6.3A
Reference StandardUL
Terminal Length0.23inch
Terminal Pitch2.54mm
Termination TypeSOLDER
Total Number of Contacts3
UL Flammability Code94V-0
PackageHeader, Vertical

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, Vietnam

Datasheet

HTSW-103-07-T-S Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the contact pitch and row count of HTSW-103-07-T-S, and how many positions does it provide?

The HTSW-103-07-T-S is a 3-position, single-row vertical header with 0.100 inch (2.54 mm) contact pitch. This compact configuration supports 3 independent signal or power connections, making it suitable for UART, I2C, SPI, and low-current power interfaces in embedded systems where board space is limited to a 0.3 inch row length.

Which embedded or IoT design scenarios benefit most from integrating the HTSW-103-07-T-S header?

IoT sensor nodes, UART debug ports, I2C peripheral headers, and low-power module connectors all benefit from the HTSW-103-07-T-S. The 3-pin, 2.54 mm pitch format is compatible with a wide range of standard 0.100 inch crimp housings and ribbon cables rated to 3 A per contact, covering most digital signal and auxiliary power needs in compact embedded board designs rated from -55°C to 125°C.

How does the matte tin over nickel contact finish of HTSW-103-07-T-S affect connector durability and mating compatibility?

The matte tin over nickel finish on HTSW-103-07-T-S provides a contact resistance below 20 milliohms at initial mating, maintaining reliable signal integrity across typical 30-plus mating cycles in lab and field environments. The nickel barrier layer beneath the tin prevents tin diffusion into the copper contact base, extending service life compared to tin-only finishes used in lower-cost headers at the same 2.54 mm pitch.

When is HTSW-103-07-T-S a practical alternative to a surface-mount 3-pin connector in a high-vibration application?

Through-hole mounting in HTSW-103-07-T-S anchors each of the 3 contacts in plated PCB vias, providing pull-out forces several times greater than surface-mount pads under vibration or cable strain. For industrial sensors, motor controllers, or outdoor IoT enclosures subject to continuous vibration at frequencies from 10 Hz to 500 Hz, through-hole headers maintain reliable electrical contact where SMD alternatives risk solder joint fatigue and intermittent opens.

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About SAMTEC

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Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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