HTSS-131-01-S-DV SAMTEC Connector (Other) In Stock
SAMTEC HTSS-131-01-S-DV is a 62-position single-row high-temperature shrouded terminal strip on a 0.100" (2.54 mm) pitch, engineered for reliable cable mating in thermally demanding industrial environments. The integral shroud polarizes and protects the 62 contacts against mis-insertion and mechanical damage. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- HTSS-131-01-S-DV Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position single-row 0.100" pitch shrouded strip consolidates high-density signal wiring into one keyed cable-mate connector
- High-temperature rated housing material tolerates sustained elevated temperatures beyond standard 85°C connector plastic limits
- Integral polarizing shroud prevents cable mis-insertion across all 62 positions, improving assembly reliability
- Dual-voltage (DV) designator supports mixed power and signal line configurations on a single connector body
Applications
The HTSS-131-01-S-DV is designed for industrial backplane assemblies, embedded computing daughtercard connections, and test equipment cable harnesses where 62 signals must be managed through a single keyed, shrouded connector. Its 0.100" pitch aligns with ubiquitous IDC ribbon cable assemblies and standard crimp-contact cable housings, minimizing tooling cost. The high-temperature plastic housing ensures reliable connector performance in enclosures with limited ventilation or proximity to heat-dissipating components operating above 85°C.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 62-position count of the HTSS-131-01-S-DV compare to a standard 40-pin or 50-pin header in high-density backplane designs?
With 62 positions on a 0.100" (2.54 mm) pitch, the HTSS-131-01-S-DV occupies approximately 157 mm of board length in a single-row format, fitting more signal lines than a 40-pin (101 mm) or 50-pin (127 mm) header in the same cable harness connector. This allows designers to replace two smaller connectors with one 62-pin unit, halving the number of mating operations required during system assembly and reducing the chance of partial or swapped connector insertions.
What distinguishes the HTSS-131-01-S-DV from the HTSS-131-01-TM-DV variant in terms of assembly method?
The -S- suffix in HTSS-131-01-S-DV indicates a solder-tab or solder-cup termination style versus the -TM- (through-mount or tape-mount) variant. The -S- variant is typically intended for direct PCB mounting via solder terminations at its base, while the -TM- version may differ in how the housing mounts or is retained on the board. Both share the 62-position, 0.100" pitch, high-temp shrouded strip format with dual-voltage (DV) capability.
Which cable assembly formats work with the 0.100" pitch of the HTSS-131-01-S-DV?
The 0.100" (2.54 mm) pitch of the HTSS-131-01-S-DV is compatible with SAMTEC's HTSF and HTS ribbon cable assemblies, standard 26–28 AWG IDC flat ribbon cables with 2.54 mm insulation displacement contacts, and discrete crimp contacts housed in 2.54 mm pitch housings. This industry-standard pitch ensures access to many second-source cable suppliers and standard crimping tools, keeping cable assembly costs competitive for both prototype and production volumes.
For a system integrator deploying equipment in a 55°C ambient enclosure, how does the high-temp housing of HTSS-131-01-S-DV provide margin?
Standard connector housings rated to 85°C provide only 30°C of thermal headroom at a 55°C ambient, which can be insufficient if the connector is mounted near a 10–20 W heat source or power module. The high-temperature housing of the HTSS-131-01-S-DV is rated beyond standard 85°C limits, providing additional margin against short-duration thermal events, reducing the risk of housing deformation that would misalign the 62 contacts and cause intermittent signal faults in deployed field equipment.
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