HPA02260IYZFR Texas Instruments Integrated Circuit (BGA) In Stock
The HPA02260IYZFR is a Texas Instruments ultra-low-power stereo consumer audio circuit in an 81-ball fine-pitch BGA package. It operates from a 1.65V to 3.6V supply voltage and integrates audio processing functions for portable consumer applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 81
- Lifecycle
- OBSOLETE
- Datasheet
- HPA02260IYZFR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of HPA02260IYZFR?
- Ultra-low-power stereo audio processing optimized for battery-operated portable consumer devices
- Wide 1.65V–3.6V supply range compatible with modern low-voltage SoC and PMIC power rails
- Compact 9x9mm 81-ball fine-pitch BGA package enables integration in slim smartphone and wearable form factors
- Single-function consumer IC simplifies BOM and reduces external component count in audio subsystem designs
What is HPA02260IYZFR used for?
The HPA02260IYZFR is designed for portable consumer electronics such as smartphones, tablets, and wireless earbuds where a compact, low-power stereo audio circuit is needed alongside a host SoC. Its 1.65V–3.6V supply compatibility allows direct connection to standard PMICs used in mobile platforms without additional level-shifting. The fine-pitch BGA package also suits slim wearable audio devices and portable media players demanding high integration density.
What are the specifications of HPA02260IYZFR?
| YTEOL | 0 |
| Additional Feature | ALSO REQUIRE SUPPLY VOLTAGE 1.65 TO 3.6V |
| Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | S-PBGA-B81 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA81,9X9,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max (Vsup) | 1.95V |
| Supply Voltage-Min (Vsup) | 1.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Philippines |
Where can I find the HPA02260IYZFR datasheet?
HPA02260IYZFR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for HPA02260IYZFR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What supply voltage does the HPA02260IYZFR require?
The HPA02260IYZFR operates from a supply voltage range of 1.65V to 3.6V, aligning with low-voltage I/O standards common in modern mobile SoCs and PMICs. This range covers both 1.8V and 3.3V regulated rails, providing flexibility in portable consumer audio system designs.
What type of audio functionality does the HPA02260IYZFR provide?
The HPA02260IYZFR is classified as an ultra-low-power stereo consumer circuit, providing integrated stereo audio processing for portable applications. It is designed to minimize quiescent current consumption while delivering stereo audio output suitable for headphone or speaker driver stages in mobile consumer devices.
What package is the HPA02260IYZFR available in?
The HPA02260IYZFR uses a very thin-profile, fine-pitch 81-ball BGA package in a 9x9mm body. This package type (VFBGA81) is common in mobile consumer ICs where board space is at a premium, enabling compact PCB layouts in smartphones, smartwatches, and wireless audio accessories.
Is the HPA02260IYZFR RoHS compliant?
Yes, the HPA02260IYZFR carries the JESD-609 code 'e1', which indicates a lead-free, RoHS-compliant package with a nickel-palladium-gold (NiPdAu) finish. This makes it suitable for environmentally compliant manufacturing processes required by European RoHS directives and global green electronics standards.
What applications is the HPA02260IYZFR designed for?
The HPA02260IYZFR targets portable consumer electronics including smartphones, tablets, portable media players, and wireless headphones. Its ultra-low-power operation and fine-pitch BGA packaging make it particularly suited for slim mobile devices where battery life and board space are critical design constraints.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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