HPA00810-2/2 Texas Instruments Integrated Circuit (Small Outline No-lead) In Stock
Texas Instruments HPA00810-2/2 is a 10-segment LED lighting driver IC in a 6-pin small-outline no-lead package with an integrated heat sink slug for thermal management, designed for direct LED array drive without a multiplexing controller. Supports up to 10 LED segments in non-multiplexed configuration. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline No-lead
- Pin Count
- 7
- Lifecycle
- OBSOLETE
- Datasheet
- HPA00810-2/2 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of HPA00810-2/2?
- 10-segment non-multiplexed LED driver architecture enables direct constant-current drive of up to 10 individual LED segments without a separate display controller
- 6-pin SOIC no-lead package (S-PDSO-N6) with integrated thermal slug reduces junction temperature and enables compact, thermally efficient LED driver PCB designs
- Single-function LED display driver with dedicated segment outputs simplifies firmware by eliminating multiplexing scan routines and reducing CPU interrupt overhead
- RoHS-compliant e4 construction suitable for consumer, industrial, and automotive LED indicator and backlighting applications requiring halogen-free materials
What is HPA00810-2/2 used for?
The HPA00810-2/2 is used in bar-graph indicator displays, LED status panels, and level meters in consumer audio equipment and industrial control panels where 10 LED segments must be driven simultaneously without multiplexing. Its integrated thermal slug in the compact no-lead package makes it suitable for high-brightness LED backlight modules in handheld devices and automotive HMI clusters where tight thermal budgets and small PCB footprints are required. It also serves as a constant-current segment driver in custom alphanumeric LED displays where each segment requires independent, stable illumination.
What are the specifications of HPA00810-2/2?
| YTEOL | 0 |
| Interface IC Type | LED DISPLAY DRIVER |
| JESD-30 Code | S-PDSO-N6 |
| JESD-609 Code | e4 |
| Multiplexed Display Capability | NO |
| Number of Functions | 1 |
| Number of Segments | 10 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 18V |
| Supply Voltage-Min | 2.7V |
| Supply Voltage-Nom | 3.6V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| fmax-Min | 0.1MHz |
| Package | Small Outline No-lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the HPA00810-2/2 datasheet?
HPA00810-2/2 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for HPA00810-2/2?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many LED segments can the HPA00810-2/2 drive, and does it require an external multiplexing controller?
The HPA00810-2/2 drives up to 10 LED segments directly and does not require an external multiplexing controller. Its non-multiplexed architecture means all 10 segments can be illuminated simultaneously with constant-current drive, which simplifies firmware, eliminates display scan interrupts, and avoids the flickering risk associated with time-multiplexed LED displays.
What thermal feature does the HPA00810-2/2 package include to manage heat in high-brightness LED applications?
The HPA00810-2/2 uses an SOIC no-lead package with an exposed metal heat-sink slug on the bottom of the device. This slug provides a low thermal resistance path directly to the PCB copper ground plane. In a properly designed PCB with thermal vias and copper pour, this reduces the junction-to-board thermal resistance compared to standard leaded small-outline packages, extending LED driver reliability at higher sustained output currents.
In which industrial or consumer display applications is the HPA00810-2/2 most commonly specified?
The HPA00810-2/2 is most commonly specified in 10-segment LED bar-graph displays for audio VU meters, battery level indicators, and industrial process level gauges. It is also used in status annunciator panels where 10 discrete LED indicators must illuminate independently to show machine states, alarm conditions, or I/O status across 10 individual LED channels driven from a single compact IC.
What package style is the HPA00810-2/2 housed in, and what board assembly considerations does it require?
The HPA00810-2/2 is housed in a 6-pin very thin-profile small-outline no-lead package (S-PDSO-N6) with a bottom heat-sink slug. Assembly requires a solder paste aperture for both the signal pads and the thermal slug pad. Designers should include thermal vias under the slug connected to an inner copper plane to achieve rated thermal performance, using standard SMT reflow at lead-free solder temperatures consistent with the e4 JEDEC-609 specification.
How does the non-multiplexed design of the HPA00810-2/2 affect LED brightness and MCU CPU load compared to a multiplexed driver?
With non-multiplexed drive, each of the 10 LED segments receives continuous constant-current supply rather than pulsed current, resulting in maximum optical brightness at a given average power. A multiplexed driver operating at 10:1 duty cycle must increase peak current 10-fold to match the same perceived brightness, increasing EMI and thermal stress on the LEDs. The non-multiplexed approach also eliminates the recurring timer interrupt and segment scan ISR required by multiplexed displays, reducing MCU CPU load by the scan routine overhead.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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