HMC574MS8E Analog Devices Integrated Circuit (Small Outline Packages) In Stock

HMC574MS8E is an Analog Devices GaAs MMIC RF switch in an MSOP-8 package featuring 0.8 dB maximum insertion loss, 36 dBm 1 dB compression point, and 50 Ω characteristic impedance. Its CMOS-compatible control interface and 39 dBm maximum CW input power suit high-power RF switching applications. Available from stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
HMC574MS8ESmall Outline Packages
Quick Facts
Manufacturer
Analog Devices
Package
Small Outline Packages
Pin Count
8
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 36 dBm 1 dB compression point and 39 dBm maximum CW input power handle high-power RF signals without gain compression
  • 0.8 dB maximum insertion loss preserves signal integrity across the 50 Ω signal path in transmit and receive switching applications
  • CMOS-compatible digital control interface enables direct interfacing with 3.3 V or 5 V logic controllers without level translators
  • MSOP-8 package provides a compact surface-mount footprint suitable for dense RF PCB layouts with 50 Ω microstrip routing

Applications

HMC574MS8E is designed for high-power RF switching in instrumentation, wireless base station test equipment, and radar front-ends where switching signals up to 39 dBm CW with less than 0.8 dB insertion loss is required. The CMOS-compatible control interface simplifies integration with FPGA or microcontroller-driven transmit/receive switching architectures in 50 Ω systems. Its compact MSOP-8 package suits space-constrained phased array modules and software-defined radio platforms.

Specifications

Pbfree CodeNo
Manufacturer Package CodeHRM-8-1
YTEOL0
1dB Compression Point36dBm
Additional FeatureCMOS COMPATIBLE
Characteristic Impedance50Ω
ConstructionCOMPONENT
Input Power-Max (CW)39dBm
Insertion Loss-Max0.8dB
Isolation-Min16dB
JESD-609 Codee3
Mounting FeatureSURFACE MOUNT
Number of Functions1
On Time-Nom0.12 µs
Operating Frequency-Max3000MHz
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeTSSOP8,.19
Port TerminationREFLECTIVE
Power Supplies5V
RF/Microwave Device TypeSPDT
Surface MountYES
TechnologyGAAS
Terminal FinishMatte Tin (Sn)
VSWR-Max1.04
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8542.39.00.01

Datasheet

HMC574MS8E Datasheet Download

Official datasheet from Analog Devices

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What power handling capability does HMC574MS8E offer, and which high-power RF applications does it support?

HMC574MS8E can handle up to 39 dBm (approximately 8 W) of continuous-wave input power and maintains linear operation up to its 36 dBm 1 dB compression point (approximately 4 W). This power handling makes it suitable for switching the output of medium-power RF amplifiers in test and measurement systems, wireless base station antenna switching, and pulsed radar transmit/receive duplexers where signal levels far exceed what PIN diode or FET switches in smaller packages can tolerate.

How does the 0.8 dB insertion loss of HMC574MS8E affect system link budget in a transmit chain?

A 0.8 dB maximum insertion loss in HMC574MS8E means that every watt of transmit power passing through the switch loses approximately 17%, which in a 36 dBm transmitter reduces the effective radiated power at the antenna port by less than 0.8 dB. For a communications link with a 20 dB fade margin, this switch loss consumes only 4% of that budget, making HMC574MS8E one of the lowest-loss options available in a surface-mount 8-pin package at high power levels.

How does CMOS compatibility simplify the control interface design for HMC574MS8E in a microcontroller-based system?

Because HMC574MS8E is CMOS-compatible, its switching control pins can be driven directly from a 3.3 V or 5 V GPIO output of a microcontroller or FPGA without any additional level-shifting circuit or dedicated RF switch driver IC. This reduces the BOM by at least 2 components per switch and eliminates the signal propagation delay introduced by a level translator, which is critical in radar or time-division duplex systems where switching must complete in less than 100 ns between transmit and receive cycles.

What isolation performance does HMC574MS8E provide, and when is 16 dB minimum isolation sufficient?

HMC574MS8E specifies a minimum isolation of 16 dB between the selected and deselected RF ports. In transmit-receive switching applications, 16 dB isolation is adequate when the receiver's front-end amplifier can tolerate a fraction of the transmitted signal leakage without compression — typically when the transmit power does not exceed 36 dBm and the receiver's 1 dB compression point is above 20 dBm. For systems requiring 30 dB or greater isolation, designers should cascade two HMC574MS8E switches or select a higher-isolation switch with a lower power handling requirement.

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About Analog Devices

Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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