HMC547LP3E Analog Devices Integrated Circuit (Quad Flat No-Lead) In Stock
HMC547LP3E is a GaAs SPDT RF switch IC by Analog Devices with high isolation and low insertion loss. Key specs: 33 dB minimum isolation, 2.5 dB maximum insertion loss, 50 Ω characteristic impedance, and 30 dBm maximum input power. Available in a compact QFN package for microwave switching applications.
- Manufacturer
- Analog Devices
- Package
- Quad Flat No-Lead
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- HMC547LP3E Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of HMC547LP3E?
- 33 dB minimum isolation provides excellent channel-to-channel signal separation in microwave switch designs
- 2.5 dB maximum insertion loss preserves signal integrity at 50 Ω impedance across the RF path
- 30 dBm maximum input power (CW) with 23 dBm 1 dB compression point supports high-power RF applications
What is HMC547LP3E used for?
The HMC547LP3E is used in microwave and millimeter-wave signal routing systems such as test and measurement instruments, radar front ends, and wireless infrastructure equipment. Its 33 dB isolation and 30 dBm input power capability make it a reliable SPDT switch for switching between antennas or signal paths in phased-array radar and satellite communication systems. The compact QFN package suits space-constrained RF module designs operating at 50 Ω impedance.
What are the specifications of HMC547LP3E?
| Pbfree Code | No |
| Manufacturer Package Code | HCP-16-3 |
| YTEOL | 0 |
| 1dB Compression Point | 23dBm |
| Additional Feature | HIGH ISOLATION |
| Characteristic Impedance | 50Ω |
| Construction | COMPONENT |
| Input Power-Max (CW) | 30dBm |
| Insertion Loss-Max | 2.5dB |
| Isolation-Min | 33dB |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Number of Functions | 1 |
| On Time-Nom | 0.006 µs |
| Operating Frequency-Max | 20000MHz |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC16,.12SQ,20 |
| RF/Microwave Device Type | SPDT |
| Surface Mount | YES |
| Terminal Finish | Matte Tin (Sn) |
| VSWR-Max | 1.33 |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
Where can I find the HMC547LP3E datasheet?
HMC547LP3E Datasheet DownloadOfficial datasheet from Analog Devices
What are equivalent replacements for HMC547LP3E?
Compatible alternatives and drop-in replacements for HMC547LP3E:
Analog Devices Inc SPDT, 0MHz Min, 20000MHz Max, 1 Func, 2.5dB Insertion Loss-Max
Frequently Asked Questions
What isolation and insertion loss does HMC547LP3E achieve in RF switching applications?
The HMC547LP3E achieves a minimum isolation of 33 dB and a maximum insertion loss of 2.5 dB at 50 Ω impedance. These parameters make it an effective SPDT switch for microwave signal routing in test equipment and radar systems where high channel-to-channel separation is critical to prevent crosstalk and signal degradation.
How much RF input power can HMC547LP3E handle before compression affects linearity?
The HMC547LP3E supports a maximum continuous wave input power of 30 dBm, with a 1 dB compression point at 23 dBm. This power handling capability allows the switch to operate in high-power RF signal paths found in radar transmit chains, power amplifier test setups, and base station antenna switching modules without significant signal distortion.
Which package does HMC547LP3E use, and how does it suit high-frequency PCB layouts?
The HMC547LP3E is housed in a 3 mm × 3 mm QFN (Quad Flat No-Lead) package with exposed thermal pad, which minimizes parasitic inductance and provides a compact 9 mm² footprint ideal for high-frequency PCB layouts above 1 GHz. The leadless package structure reduces bond-wire parasitics and supports flush mounting for improved thermal and electrical performance at microwave frequencies.
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Why Buy from FindMyChip
About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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