HMC485MS8GETR Analog Devices Integrated Circuit (Small Outline Packages) In Stock
The HMC485MS8GETR is a high IP3 GaAs MMIC double-balanced mixer with integrated LO amplifier operating from 1.7 to 2.4 GHz, delivering exceptional linearity and low conversion loss for wireless infrastructure designs. It features +23 dBm IIP3 and is housed in an 8-lead TSSOP SMT package for compact board layouts. Available in tape-and-reel packaging with worldwide shipping.
- Manufacturer
- Analog Devices
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- HMC485MS8GETR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of HMC485MS8GETR?
- High IIP3 of +23 dBm for excellent linearity in high-dynamic-range receiver chains
- Integrated LO amplifier reduces external component count and simplifies RF board design
- 1.7 to 2.4 GHz operating frequency covers 1900 MHz PCS, 2.1 GHz WCDMA, and 2.4 GHz ISM bands
- Low conversion loss for minimal noise degradation in upconversion and downconversion mixers
- Compact 8-lead TSSOP (MSOP-8) SMT package enables small-form-factor RF module designs
What is HMC485MS8GETR used for?
The HMC485MS8GETR is designed for base station receivers, wireless infrastructure transceivers, and point-to-point radio links operating in the 1.7 to 2.4 GHz frequency range where high linearity and low noise are critical. Its integrated LO amplifier and high +23 dBm IIP3 make it well suited for 3G/4G cellular uplink and downlink conversion stages. It also serves instrumentation and test equipment applications requiring precise frequency translation across the 1.7–2.4 GHz band.
What are the specifications of HMC485MS8GETR?
| Pbfree Code | No |
| Manufacturer Package Code | HRH-8-1 |
| YTEOL | 0 |
| JESD-30 Code | S-PDSO-G8 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Nom | 5V |
| Surface Mount | YES |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
Where can I find the HMC485MS8GETR datasheet?
HMC485MS8GETR Datasheet DownloadOfficial datasheet from Analog Devices
What are equivalent replacements for HMC485MS8GETR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What IIP3 performance does the HMC485MS8GETR deliver, and why does it matter for base station designs?
The HMC485MS8GETR achieves an input third-order intercept point (IIP3) of +23 dBm, which is critical for base station receivers that must handle strong adjacent-channel interferers without generating intermodulation distortion. This high linearity allows the mixer to operate cleanly in dense cellular deployments across its 1.7 to 2.4 GHz operating band.
How does the integrated LO amplifier in the HMC485MS8GETR reduce system design complexity?
By integrating the LO amplifier on-chip, the HMC485MS8GETR eliminates the need for an external LO buffer amplifier, reducing BOM cost, PCB area, and the number of RF interconnects that can introduce impedance mismatch or signal loss. This simplification is especially valuable in space-constrained radio modules where the 8-lead TSSOP package keeps the RF section compact.
Which wireless frequency bands can the HMC485MS8GETR support in a downconversion receiver?
The HMC485MS8GETR covers 1.7 to 2.4 GHz, encompassing the 1.9 GHz PCS band, 2.1 GHz WCDMA/UMTS band, and 2.4 GHz ISM band used by Wi-Fi and Bluetooth, making it a versatile single-chip mixer solution for multi-standard radio receivers that must handle 8 or more simultaneous channels in infrastructure equipment.
What package does the HMC485MS8GETR use, and how does it affect PCB assembly?
The HMC485MS8GETR is housed in an 8-lead thin shrink small-outline (TSSOP) SMT package with a peak reflow temperature of 260°C, compatible with standard lead-free solder processes. The compact footprint of approximately 3 mm × 3 mm facilitates tight RF layout with short signal traces, reducing parasitics at frequencies up to 2.4 GHz.
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Why Buy from FindMyChip
About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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