HD74LV14AFP-E Renesas Electronics Integrated Circuit (Small Outline Packages) In Stock
HD74LV14AFP-E from Renesas Electronics is a integrated circuit for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 14 pins, -40°C to 85°C, SOIC package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The SOIC format supports standard assembly and sourcing workflows.
- Manufacturer
- Renesas Electronics
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- TRANSFERRED
- Datasheet
- HD74LV14AFP-E Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 14 pins rating/value supports defined circuit selection for this integrated circuit
- -40°C to 85°C specification provides an additional quantitative design check
- SOIC package or footprint supports standard PCB assembly and replacement planning
- 14-pin configuration helps confirm footprint, routing, and connector compatibility
- -40°C to 85°C operating range suits controlled industrial or commercial environments
- Renesas Electronics sourcing identity supports BOM traceability and authorized-equivalent review
Applications
HD74LV14AFP-E is commonly considered for industrial controls, embedded electronics, maintenance sourcing, and production assemblies where designers need a integrated circuit with 14 pins, -40°C to 85°C, SOIC package/footprint. It is suitable for OEM BOM refresh, maintenance sourcing, prototype builds, and production assemblies that require traceable component selection.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Family | LV/LV-A/LVX/H |
| JESD-30 Code | R-PDSO-G14 |
| Logic IC Type | INVERTER |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Propagation Delay (tpd) | 27ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Vietnam |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for HD74LV14AFP-E:
suggested
Frequently Asked Questions
Which designs are a good fit for HD74LV14AFP-E when 14 pins is required?
HD74LV14AFP-E is a integrated circuit from Renesas Electronics for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. The 14 pins specification helps engineers confirm electrical margin before adding it to a production BOM.
How should engineers check the footprint before placing HD74LV14AFP-E on a PCB?
Review the SOIC package information together with 14 pins before layout release. That check reduces substitution risk when matching land pattern, assembly process, and approved vendor data.
When would procurement choose HD74LV14AFP-E instead of a nearby alternate?
Buyers should keep HD74LV14AFP-E when the approved design depends on -40°C to 85°C and SOIC compatibility. Alternate reviews should verify at least 1 matching electrical rating and footprint constraint.
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Why Buy from FindMyChip
About Renesas Electronics
Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog products, and SoC solutions for automotive, industrial, and IoT applications.
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