HD3SS214IZQER Texas Instruments Integrated Circuit (BGA) In Stock
DisplayPort 1.3 differential switch supporting 8.1 Gbps per lane in a 2:1 or 1:2 mux/demux configuration for high-speed video routing. Housed in a 50-ball BGA, RoHS compliant, for laptop, dock, and monitor switching designs. In stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 50
- Lifecycle
- OBSOLETE
- Datasheet
- HD3SS214IZQER Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of HD3SS214IZQER?
- 8.1 Gbps per-lane bandwidth fully supports DisplayPort 1.3 HBR3 data rates for 4K 60 Hz or 8K 30 Hz video without signal re-timing or redriving
- 2:1/1:2 differential switch topology allows a single DP port to be shared between 2 sources or 2 sinks, enabling compact laptop and docking station designs with one IC
- 50-ball BGA (PBGA-B50) with Pb-free, RoHS-compliant construction fits high-density USB-C combo switch boards where size and environmental compliance are mandatory
What is HD3SS214IZQER used for?
HD3SS214IZQER is designed for USB-C and Thunderbolt docking stations, laptops, and monitors that need to switch a DisplayPort 1.3 signal path between 2 sources or distribute 1 source to 2 sinks at speeds up to 8.1 Gbps per lane. It is also a strong fit for embedded display mux designs in all-in-one PCs and gaming laptops where a discrete GPU and an integrated GPU share the same external DP connector and alternate routing must occur without visible glitches.
What are the specifications of HD3SS214IZQER?
| Pbfree Code | Yes |
| Date Of Intro | 2016-04-02 |
| YTEOL | 0 |
| Analog IC - Other Type | DIFFERENTIAL MULTIPLEXER |
| JESD-30 Code | S-PBGA-B50 |
| JESD-609 Code | e1 |
| Normal Position | NO |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Output | COMMON OUTPUT |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA50,9X9,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Current-Max (Isup) | 5mA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
Where can I find the HD3SS214IZQER datasheet?
HD3SS214IZQER Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for HD3SS214IZQER?
Compatible alternatives and drop-in replacements for HD3SS214IZQER:
Frequently Asked Questions
Does HD3SS214IZQER support DisplayPort 1.4 HBR3 rates, or is it limited to DisplayPort 1.3?
HD3SS214IZQER is specified for DisplayPort 1.3 and supports per-lane data rates up to 8.1 Gbps, which corresponds to the HBR3 rate also used in DisplayPort 1.4. Because HBR3 at 8.1 Gbps per lane is the highest speed in both DP 1.3 and DP 1.4, the switch passes DP 1.4 HBR3 traffic transparently—sufficient for 4K 60 Hz at 10-bit colour or 8K 30 Hz at 4:2:0. It does not add DSC or FEC, which are DP 1.4 application-layer features handled by the source and sink.
For a USB-C docking station design, how does HD3SS214IZQER fit into a 2-source, 1-output DP switching topology?
In a docking station with both a laptop-side USB-C connector and an external HDMI-to-DP bridge, HD3SS214IZQER's 2:1 input mode routes one of the 2 high-speed differential inputs to the single DP output connector. A control signal from the host MCU or Type-C CC logic selects which source is active. Because the switch operates passively at up to 8.1 Gbps per lane, no re-timing latency is introduced—critical for maintaining DP AUX channel handshakes and HPD signalling integrity within the 100 µs protocol window.
What is the package of HD3SS214IZQER and how does its ball count affect PCB routing complexity?
HD3SS214IZQER uses a 50-ball PBGA with a standard ball pitch (typically 0.5 mm based on JEDEC PBGA-B50 convention). Routing 4 differential pairs at 8.1 Gbps from the BGA requires controlled-impedance trace design at 90 Ω differential and length matching within 100 µm across each pair. The 50-ball count is manageable on a 6-layer PCB with a dedicated high-speed signal layer, and the tight ball pitch demands a via-in-pad or micro-via fanout strategy for production boards.
When should HD3SS214IZQER be preferred over a DP redriver or retimer for a short-board switching application?
HD3SS214IZQER is the right choice when the DP signal path between source and sink is short—typically under 8 inches (200 mm) of FR-4 trace—and the channel loss is below 8 dB at 4 GHz. In that scenario, a passive switch adds less than 1 dB insertion loss and avoids the power consumption of 100 mW to 300 mW that an active redriver or retimer would consume. For longer paths or lossy connectors, a redriver or retimer that can restore the eye diagram above DP 1.3 receiver sensitivity is the safer choice.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit