HCPL-181-060E Avago Technologies Phototransistor (Small Outline Packages) In Stock
The Avago HCPL-181-060E is a single-channel phototransistor optocoupler in a 4-pin SOIC package, providing 3.75 kV isolation with 50 mA forward current and 80 V collector-emitter breakdown voltage. It delivers reliable galvanic isolation for logic-level signal transmission in industrial control, power supply feedback, and safety-critical switching circuits.
- Manufacturer
- Avago Technologies
- Package
- Small Outline Packages
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- HCPL-181-060E Datasheet PDF
- Category
- Phototransistor
- Temp Range
- -55.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 3.75 kV input-to-output isolation voltage rating for robust galvanic separation in industrial and power conversion circuits
- 50 mA maximum forward current with 50% current transfer ratio (CTR) enabling reliable logic-level signal coupling
- 4-pin SOIC package with UL recognition, RoHS compliance, and 80 V collector-emitter breakdown for compact SMT isolation designs
Applications
The HCPL-181-060E is used in AC/DC power supply feedback loops, where it isolates the secondary side control signal from the primary side PWM controller at up to 3.75 kV. Industrial programmable logic controllers (PLCs) and motor drive input stages use it to protect sensitive logic circuitry from high-voltage transients on digital I/O lines. It is also found in medical equipment signal isolation, solar inverter gate drive feedback, and relay drive circuits requiring UL-recognized isolation components.
Specifications
| Pbfree Code | Yes |
| Reach Compliance Code | Compliant |
| YTEOL | 8 |
| Additional Feature | UL RECOGNIZED |
| Coll-Emtr Bkdn Voltage-Min | 80V |
| Configuration | SINGLE |
| Current Transfer Ratio-Min | 50% |
| Current Transfer Ratio-Nom | 50% |
| Dark Current-Max | 100nA |
| Forward Current-Max | 0.05A |
| Forward Voltage-Max | 1.4V |
| Isolation Voltage-Max | 3750V |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Number of Elements | 1 |
| On-State Current-Max | 0.05A |
| Optoelectronic Device Type | TRANSISTOR OUTPUT OPTOCOUPLER |
| Packing Method | TR |
| Power Dissipation-Max | 0.15W |
| Response Time-Max | 0.000018s |
| Surface Mount | YES |
| Terminal Finish | Matte Tin (Sn) |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8541.40.80.00 |
| Country of Origin | Mainland China |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for HCPL-181-060E:
suggested
suggested
suggested
Frequently Asked Questions
What isolation voltage and current transfer ratio does the HCPL-181-060E provide for power supply feedback designs?
The HCPL-181-060E provides a 3.75 kV isolation voltage between input and output, sufficient for most industrial and consumer power supply isolation requirements. Its current transfer ratio (CTR) is specified at a minimum of 50%, meaning a 10 mA LED input current will produce at least 5 mA of collector current at the phototransistor output. This CTR enables reliable operation in flyback converter feedback loops where a 50 mA maximum forward current is available from the feedback circuit.
For which industrial automation designs does the HCPL-181-060E's single-channel SOIC configuration offer the best fit?
The 4-pin SOIC package and single-channel configuration make the HCPL-181-060E ideal for point-of-isolation designs in PLC digital input modules, where one optocoupler per field input is standard practice. At 80 V collector-emitter breakdown and 3.75 kV isolation, it can interface 24 V DC industrial field signals to 3.3 V or 5 V logic while protecting against up to several kilovolts of common-mode transients. Its compact SOIC footprint allows 8 to 16 isolation channels to fit within a single PCB slot of a DIN-rail mounted I/O module.
How does the HCPL-181-060E compare with through-hole optocouplers when specifying a component for RoHS-compliant automated PCB assembly?
As a surface mount SOIC-4 device with RoHS-compliant lead-free construction, the HCPL-181-060E eliminates the through-hole drilling and wave soldering steps required by DIP-4 through-hole optocouplers, reducing assembly cost. It is fully compatible with standard SMT pick-and-place and reflow processes at peak temperatures up to 260°C. By contrast, typical 4-pin DIP optocouplers such as the PC817 require 2.54 mm pitch through-hole pads and manual or wave solder, adding cycle time and limiting PCB routing density in designs targeting 100 or more isolation channels per board.
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About Avago Technologies
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