FX8-140S-SV Hirose Connector (Other) In Stock
The Hirose FX8-140S-SV is a 140-position low-profile board-stacking receptacle connector measuring 1.913 inches in length with a 0.089-inch stack height, featuring peg board mounting and Pb-free construction for high-density multi-board interconnection. It targets compact embedded computing modules, wireless communication boards, and industrial SoM carrier designs.
- Manufacturer
- Hirose
- Package
- Other
- Pin Count
- 140
- Lifecycle
- ACTIVE
- Datasheet
- FX8-140S-SV Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 140 positions in a 1.913-inch body enable high pin-count board stacking without increasing PCB footprint across multiple signal and power rails
- Low-profile 0.089-inch stack height minimises z-axis clearance between stacked boards in slim embedded and IoT module assemblies
- PEG mounting option locks the connector to the PCB before soldering, improving alignment accuracy in automated SMT placement
- Pb-free RoHS-compliant terminations support lead-free wave and reflow soldering processes in environmentally regulated markets
Applications
The FX8-140S-SV is used in board-stacking configurations for compact embedded computing modules, SOM-to-carrier board interfaces, and high-density wireless communication boards where 140 signals must transit between PCB layers in the minimum possible z-axis stack height. Its low-profile receptacle design also suits industrial HMI displays and portable medical devices where stacked PCB assemblies must fit within enclosures constrained to under 10 mm total board separation.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 16Weeks |
| YTEOL | 8 |
| Additional Feature | LOW PROFILE |
| Board Mounting Option | PEG |
| Body Breadth | 0.22inch |
| Body Depth | 0.089inch |
| Body Length | 1.913inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Gold (Au) |
| Contact Gender | FEMALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 45mΩ |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 300VAC V |
| Durability | 50Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BROWN |
| Insulator Material | POLYPHENYLENE SULFIDE |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.024inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 5.6896mm |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 0.4A |
| Reference Standard | UL |
| Terminal Pitch | 0.6mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 140 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Japan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the FX8-140S-SV provide, and what signal density does that enable for a dual-board SOM design?
The FX8-140S-SV provides 140 positions across a 1.913-inch body, supporting simultaneous routing of high-speed data lanes, multiple power rails, and control signals between a system-on-module and its carrier PCB without requiring additional connectors. At a standard 0.5 mm pitch, 140 pins can accommodate interfaces such as USB 3.0, PCIe ×4, MIPI CSI-2, I²C, SPI, and multiple GPIO banks in a single compact mated pair.
What is the stacked board separation achieved with the FX8-140S-SV, and how does that constrain enclosure height?
The FX8-140S-SV has a body depth of 0.089 inches (approximately 2.26 mm), which defines the minimum board-to-board separation when mated with its complementary plug. Enclosure designers must add the PCB thickness—typically 1.6 mm each—to calculate the total internal height consumed by the dual-board assembly, which is typically under 7 mm, enabling slim embedded computing products with enclosure heights below 15 mm.
What does the PEG mounting feature on the FX8-140S-SV add during PCB assembly, and why is it beneficial for 140-pin connectors?
The PEG mounting tabs press into PCB holes to mechanically lock the FX8-140S-SV in position before and during reflow soldering. For a 140-pin connector spanning nearly 49 mm, this prevents rotation or shifting on the paste deposit when the board enters the reflow oven, eliminating co-planarity defects across all 140 solder joints that would otherwise require costly X-ray inspection and rework.
What lead time should supply chain teams plan around for the FX8-140S-SV, given its 16-week factory lead time?
The FX8-140S-SV carries a 16-week factory lead time from Hirose, which is longer than many commodity connectors. Programs building SOM carrier boards or embedded computing modules should maintain at least 5 months of projected consumption in pipeline and safety stock, and issue purchase orders at project kick-off rather than at BOM freeze to avoid schedule delays during NPI and volume ramp phases.
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