FX230 FTDI Chip Integrated Circuit (Small Outline Packages) In Stock
FX230 is a FTDI Chip Integrated Circuit for embedded systems, signal routing, communication interfaces, and control electronics. It combines 0°C to 0°C with Small Outline Packages with 16 pins. FindMyChip supports technical sourcing, stock checks, and worldwide shipping for this part.
- Manufacturer
- FTDI Chip
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- FX230 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0°C to 0°C key electrical or mechanical rating from supplier data
- Small Outline Packages with 16 pins package information for PCB and assembly planning
- Integrated Circuit classification for BOM search, sourcing, and alternates review
- Manufacturer-listed FTDI Chip part number for traceable procurement workflows
Applications
FX230 is suited to embedded systems, signal routing, communication interfaces, and control electronics, especially when engineers need 0°C to 0°C and a traceable FTDI Chip sourcing path. It supports repair, prototype, and production purchasing workflows where package, lifecycle, and parameter checks must be reviewed before release.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design requirements make FX230 a good fit for integrated circuit applications?
FX230 is a FTDI Chip Integrated Circuit that suits embedded systems, signal routing, communication interfaces, and control electronics when the design needs 0°C to 0°C. Engineers should compare the captured supplier parameters with the final datasheet before release.
How should engineers account for package or assembly constraints on FX230?
The available package data lists Small Outline Packages with 16 pins, and the relevant rating includes 0°C to 0°C. Check footprint, thermal margin, and assembly notes against the approved datasheet before committing the PCB.
What should procurement teams confirm before quoting FX230 for production builds?
Procurement should confirm quantity, date code, lifecycle status, and acceptable alternates for FX230. The sourcing review should include 0°C to 0°C so engineering and purchasing evaluate the same requirement.
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About FTDI Chip
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