FX23-100P-0.5SV15 Hirose Connector (Other) In Stock
The Hirose FX23-100P-0.5SV15 is a high-density board stacking connector measuring 1.524 x 0.35 x 0.506 inches with 100-pin configuration at 0.5 mm pitch for compact multi-board interconnection in data center, telecommunications, and server applications. This surface-mount connector features gold-plated contacts with peg-mounted PCB retention system and Pb-free construction for reliable signal integrity and power distribution across stacked modules. Available globally with 12-week lead time for high-speed backplane design and production system integration.
- Manufacturer
- Hirose
- Package
- Other
- Pin Count
- 108
- Lifecycle
- ACTIVE
- Datasheet
- FX23-100P-0.5SV15 Datasheet PDF
- Category
- Connector
- Price
- From $2.5757(MOQ 1)
- Temp Range
- -55.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of FX23-100P-0.5SV15?
- High-density 100-pin FX23 board stacking connector with 0.5mm pitch for compact multi-board interconnection
- Gold-plated contacts with peg-mounted PCB retention ensuring robust mechanical and electrical connection in vibration-prone environments
- Pb-free surface-mount design for data center and telecommunications equipment meeting RoHS compliance and long-term reliability requirements
What is FX23-100P-0.5SV15 used for?
The FX23-100P-0.5SV15 is ideal for data center server backplanes, telecommunications switching equipment, and high-speed digital signal routing where dense board-to-board connectivity is critical for low-latency inter-module communication. It is widely deployed in rack-mounted networking equipment, storage area networks (SANs), and telecommunications switching matrices requiring 100-pin high-speed interconnect at compact 0.5 mm pitch spacing to maximize module density and minimize form factor across 12-week production lead times for enterprise infrastructure.
What are the specifications of FX23-100P-0.5SV15?
| Pbfree Code | Yes |
| Factory Lead Time | 12Weeks |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.35inch |
| Body Depth | 0.506inch |
| Body Length | 1.524inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Gold (Au) |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 70mΩ |
| Contact Style | CENTRONIC |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 150VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 100000000Ω |
| Insulator Color | BLACK |
| Insulator Material | POLYAMIDE |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.02inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 6mm |
| Rated Current (Signal) | 0.5A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 100 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia |
Where can I find the FX23-100P-0.5SV15 datasheet?
FX23-100P-0.5SV15 Datasheet DownloadOfficial datasheet from Hirose
What are equivalent replacements for FX23-100P-0.5SV15?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch spacing of the Hirose FX23-100P-0.5SV15 board stacking connector?
The Hirose FX23-100P-0.5SV15 delivers 100-pin high-density configuration at 0.5 mm pitch spacing, enabling compact board-to-board interconnection measuring 1.524 x 0.35 x 0.506 inches total package size. The 100-pin arrangement at 0.5 mm pitch provides 8 pins per millimeter density, making this connector ideal for data center and telecommunications equipment requiring maximum signal and power traces in minimum PCB footprint for dense rack-mounted server backplane and switching system designs.
For data center server backplane design, how does the 0.5mm pitch FX23-100P compare to standard 1.27mm pitch connectors?
The Hirose FX23-100P-0.5SV15 at 0.5 mm pitch provides 2.5x higher pin density compared to 1.27 mm pitch standard connectors, eliminating need for multiple connector banks and reducing backplane component count by 60-70%. The compact 100-pin 0.5 mm pitch design delivers equivalent signal capacity to four standard connectors in single compact module, saving 2-3 inches of board depth in server rack systems and enabling high-speed SerDes interconnect at 10-25 Gbps per channel in enterprise data center deployments.
What is the mounting method and contact finish specification of the FX23-100P-0.5SV15?
The Hirose FX23-100P-0.5SV15 features peg-mounted (PEG) PCB retention system with gold-plated contact termination ensuring robust mechanical hold during board insertion and withdrawal cycles. The surface-mount board stacking configuration measures 1.524 x 0.35 x 0.506 inches with gold-plated contacts providing excellent electrical continuity and corrosion resistance across 500+ mating cycles in data center and telecommunications applications operating at 12-week manufacturing lead times.
Is the Hirose FX23-100P-0.5SV15 suitable for telecommunications and data center infrastructure applications?
Yes, the Hirose FX23-100P-0.5SV15 features 100-pin high-density at 0.5 mm pitch, gold-plated contacts, peg-mounted PCB retention, and Pb-free construction making it ideal for telecommunications switching equipment and data center server backplanes. The connector is widely deployed in high-speed network switches, storage area network (SAN) systems, and telecommunications routing matrices requiring dense board-stacking interconnect at 10-25 Gbps signal speeds across 12-week production lead times for mission-critical telecom and data center infrastructure.
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About Hirose
Hirose is a leading electronic component manufacturer. FindMyChip sources Hirose ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $2.5757 | $2.58 |
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