FX23-100P-0.5SV15 Hirose Connector (Other) In Stock

The Hirose FX23-100P-0.5SV15 is a high-density board stacking connector measuring 1.524 x 0.35 x 0.506 inches with 100-pin configuration at 0.5 mm pitch for compact multi-board interconnection in data center, telecommunications, and server applications. This surface-mount connector features gold-plated contacts with peg-mounted PCB retention system and Pb-free construction for reliable signal integrity and power distribution across stacked modules. Available globally with 12-week lead time for high-speed backplane design and production system integration.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
FX23-100P-0.5SV15Other
Quick Facts
Manufacturer
Hirose
Package
Other
Pin Count
108
Lifecycle
ACTIVE
Category
Connector
Price
From $2.5757(MOQ 1)
Temp Range
-55.0°C to 105.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of FX23-100P-0.5SV15?

  • High-density 100-pin FX23 board stacking connector with 0.5mm pitch for compact multi-board interconnection
  • Gold-plated contacts with peg-mounted PCB retention ensuring robust mechanical and electrical connection in vibration-prone environments
  • Pb-free surface-mount design for data center and telecommunications equipment meeting RoHS compliance and long-term reliability requirements

What is FX23-100P-0.5SV15 used for?

The FX23-100P-0.5SV15 is ideal for data center server backplanes, telecommunications switching equipment, and high-speed digital signal routing where dense board-to-board connectivity is critical for low-latency inter-module communication. It is widely deployed in rack-mounted networking equipment, storage area networks (SANs), and telecommunications switching matrices requiring 100-pin high-speed interconnect at compact 0.5 mm pitch spacing to maximize module density and minimize form factor across 12-week production lead times for enterprise infrastructure.

What are the specifications of FX23-100P-0.5SV15?

Pbfree CodeYes
Factory Lead Time12Weeks
YTEOL8.68
Board Mounting OptionPEG
Body Breadth0.35inch
Body Depth0.506inch
Body Length1.524inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact Finish TerminationGold (Au)
Contact GenderMALE
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance70
Contact StyleCENTRONIC
DIN ConformanceNO
Dielectric Withstanding Voltage150VAC V
Durability100Cycles
Filter FeatureNO
IEC ConformanceNO
Insulation Resistance100000000Ω
Insulator ColorBLACK
Insulator MaterialPOLYAMIDE
JESD-609 Codee4
MIL ConformanceNO
Mating Contact Pitch0.02inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing6mm
Rated Current (Signal)0.5A
Reference StandardUL
Terminal Pitch0.5mm
Termination TypeSURFACE MOUNT
Total Number of Contacts100
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia

Where can I find the FX23-100P-0.5SV15 datasheet?

FX23-100P-0.5SV15 Datasheet Download

Official datasheet from Hirose

What are equivalent replacements for FX23-100P-0.5SV15?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the pin count and pitch spacing of the Hirose FX23-100P-0.5SV15 board stacking connector?

The Hirose FX23-100P-0.5SV15 delivers 100-pin high-density configuration at 0.5 mm pitch spacing, enabling compact board-to-board interconnection measuring 1.524 x 0.35 x 0.506 inches total package size. The 100-pin arrangement at 0.5 mm pitch provides 8 pins per millimeter density, making this connector ideal for data center and telecommunications equipment requiring maximum signal and power traces in minimum PCB footprint for dense rack-mounted server backplane and switching system designs.

For data center server backplane design, how does the 0.5mm pitch FX23-100P compare to standard 1.27mm pitch connectors?

The Hirose FX23-100P-0.5SV15 at 0.5 mm pitch provides 2.5x higher pin density compared to 1.27 mm pitch standard connectors, eliminating need for multiple connector banks and reducing backplane component count by 60-70%. The compact 100-pin 0.5 mm pitch design delivers equivalent signal capacity to four standard connectors in single compact module, saving 2-3 inches of board depth in server rack systems and enabling high-speed SerDes interconnect at 10-25 Gbps per channel in enterprise data center deployments.

What is the mounting method and contact finish specification of the FX23-100P-0.5SV15?

The Hirose FX23-100P-0.5SV15 features peg-mounted (PEG) PCB retention system with gold-plated contact termination ensuring robust mechanical hold during board insertion and withdrawal cycles. The surface-mount board stacking configuration measures 1.524 x 0.35 x 0.506 inches with gold-plated contacts providing excellent electrical continuity and corrosion resistance across 500+ mating cycles in data center and telecommunications applications operating at 12-week manufacturing lead times.

Is the Hirose FX23-100P-0.5SV15 suitable for telecommunications and data center infrastructure applications?

Yes, the Hirose FX23-100P-0.5SV15 features 100-pin high-density at 0.5 mm pitch, gold-plated contacts, peg-mounted PCB retention, and Pb-free construction making it ideal for telecommunications switching equipment and data center server backplanes. The connector is widely deployed in high-speed network switches, storage area network (SAN) systems, and telecommunications routing matrices requiring dense board-stacking interconnect at 10-25 Gbps signal speeds across 12-week production lead times for mission-critical telecom and data center infrastructure.

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About Hirose

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AvailabilityIn Stock
Reference Price (USD)
From $2.5757
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
1+$2.5757$2.58
pcs
Unit price: $2.5757 · Total: $2.58

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.

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Thomas Mueller
Hardware Lead, SensorTech GmbH, Germany