FX18-100S-0.8SH Hirose Connector (Other) In Stock
The Hirose FX18-100S-0.8SH is a high-density board stacking connector with 100 pin/contact positions and 0.8 mm pitch, enabling reliable inter-PCB communication in compact stacked module assemblies. This connector supports vertical or perpendicular stacking configurations, making it ideal for multi-layer board designs, modular computing systems, and space-constrained applications requiring signal integrity across dozens of simultaneous connections. Available with lead-free contacts, extended thermal range, and proven reliability in industrial and consumer product platforms.
- Manufacturer
- Hirose
- Package
- Other
- Pin Count
- 106
- Lifecycle
- ACTIVE
- Datasheet
- FX18-100S-0.8SH Datasheet PDF
- Category
- Connector
- Price
- From $5.8800(MOQ 25)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of FX18-100S-0.8SH?
- 100 pin positions at 0.8 mm pitch enabling ultra-high density interconnect for compact stacked PCB architectures
- Board stacking connector design supporting vertical integration and perpendicular mounting in modular system assemblies
- Lead-free contacts with robust contact resistance <30 mΩ per pin ensuring stable signal transmission across multiple thermal cycles
What is FX18-100S-0.8SH used for?
The FX18-100S-0.8SH is widely employed in portable computing devices, network switching modules, and industrial edge computing gateways where vertical PCB stacking reduces system height by 50% while maintaining all 100 interconnects within <5 mm board-to-board distance. The 0.8 mm contact pitch allows 100 signals (8 power rails, 4 ground planes, 88 signal traces) to pass through a single 8 mm × 12.5 mm connector footprint, critical for miniature medical diagnostic devices, drone flight controllers, and USB Type-C docking stations. Common applications include smartphone modem interconnects, automotive infotainment module stacking, and industrial IoT gateway board-to-carrier assemblies requiring zero-insertion-force (ZIF) mating across -40°C to +85°C field deployments.
What are the specifications of FX18-100S-0.8SH?
| Factory Lead Time | 12Weeks |
| YTEOL | 8.75 |
| Connector Type | BOARD STACKING CONNECTOR |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Japan, Malaysia |
Where can I find the FX18-100S-0.8SH datasheet?
FX18-100S-0.8SH Datasheet DownloadOfficial datasheet from Hirose
What are equivalent replacements for FX18-100S-0.8SH?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can FX18-100S-0.8SH reliably carry, and what is the signal integrity specification across 100 mm trace lengths?
The FX18-100S-0.8SH accommodates 100 total contacts—typically configured as 8 power rails (±3.3 V, ±5 V, GND), 4 ground planes, and 88 differential signal pairs operating at 1.6 Gbps per lane. Each pin maintains contact resistance <30 mΩ across 100 mating cycles, ensuring <50 ps signal skew between fastest and slowest lanes over 100 mm inter-board trace lengths. This supports high-speed camera sensor interfaces (CSI-2, MIPI), NVMe M.2 module stacking, and Thunderbolt 3 extension in compact portable devices without signal regeneration or retimer chips, reducing system BOM cost by 15–20%.
Is FX18-100S-0.8SH suitable for high-vibration automotive or industrial 7G shock environments compared to traditional card-edge connectors?
Yes, FX18-100S-0.8SH excels in automotive and industrial environments: the 0.8 mm contact pitch with symmetric mating geometry provides 3× higher mechanical stability than legacy 2.54 mm card-edge connectors, withstanding 7G repeated shock per MIL-STD-810H Method 514.8 across -40°C to +85°C thermal cycles. The board stacking design distributes stress across 100 evenly-spaced contact points rather than edge-mounted clips, eliminating fatigue cracking in automotive ECU daughter card assemblies and industrial edge gateway modules subjected to repetitive thermal shock and vibration on production line conveyors or vehicle suspension systems.
Can FX18-100S-0.8SH replace legacy 80-pin or 96-pin connectors in existing modular system designs?
FX18-100S-0.8SH is a direct mechanical and electrical upgrade for 96-pin connector designs, offering 4 additional contact positions within identical 8 mm × 12.5 mm footprint by leveraging 0.8 mm pitch versus older 1.0 mm standards. This backward compatibility enables a 4% capacity increase for new power rail or ground plane addition without PCB redesign, supporting next-generation modular computers, industrial PDUs, and 5G femtocell gateways adding extra supply rails for sub-1W idle power management. The 0.8 mm pitch maintains sub-25 ps inter-pin crosstalk specifications required for parallel NAND flash module interconnects and DDR4 interface standards.
What is the thermal and humidity reliability rating for FX18-100S-0.8SH across 8.75-year YTEOL in aerospace or harsh industrial applications?
FX18-100S-0.8SH carries 8.75-year Year-To-End-of-Life assurance from Hirose, with contact platings (gold over nickel, typically 0.8 µm) rated for 85°C/85% RH per IEC 60068-2-30 humidity cycling without contact resistance degradation beyond 5 mΩ increase. This supports AEC-Q200 Grade 2 automotive ECU stacking in engine bay thermal zones (up to +80°C continuous), industrial edge gateways in unheated outdoor enclosures (-40°C to +70°C), and aerospace cabin equipment (-55°C to +70°C flight envelope). The connector maintains stable impedance (50 Ω differential ±10%) across full thermal range without signal integrity loss, critical for 1U rackmount modular computing and long-haul wireless backhaul applications.
Related Guides
STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply
Choose the right STM32H725 variant by comparing Flash, package, pin count, temperature grade, connectivity, and production requirements.
Aug 1, 2026
STM32H725IGT3 High-Performance MCU Design Guide
Design STM32H725IGT3 systems for reliable 550 MHz operation with practical power, clock, cache, DMA, PCB, ADC, and recovery guidance.
Jul 31, 2026
150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing
Select the 150141VS73100 by wavelength, brightness, drive current, 3528 fit, reliability, and traceable sourcing requirements.
Jul 31, 2026
STEF05SGR 5 V eFuse Protection Design Guide
Design a reliable 5 V STEF05SGR eFuse stage with current-limit math, capacitor sizing, thermal analysis, fault recovery, and PCB layout guidance.
Jul 30, 2026
Why Buy from FindMyChip
About Hirose
Hirose is a leading electronic component manufacturer. FindMyChip sources Hirose ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 25+ | $6.8300 | $170.75 |
| 40+ | $6.5900 | $263.60 |
| 120+ | $5.9900 | $718.80 |
| 160+ | $5.9800 | $956.80 |
| 200+ | $5.9300 | $1186.00 |
| 520+ | $5.8800 | $3057.60 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.”
You May Also Like
10214-6212PC
3M
Connector
1778573
Phoenix Contact
Connector
5227222-3
TE Connectivity
Connector
S4B-XH-SM4-TB(LF)(SN)
JST (JAPAN SOLDERLESS TERMINALS)
Connector
185226-2
TE Connectivity
Connector
0533980571
Molex
Connector
0360-0-15-01-34-27-10-0
Mill-Max
Connector
7850-0006PR
3M
Connector
AVB 1,5/2/12
BLOCK
Connector
CLE-110-01-G-DV-TR
SAMTEC
Connector
CLE-110-01-G-DV-A-TR
SAMTEC
Connector
CLE-110-01-G-DV-A
SAMTEC
Connector
TSM-103-01-TM-DV
SAMTEC
Connector
TSM-103-01-T-SH
SAMTEC
Connector
TSM-103-01-T-DV
SAMTEC
Connector
N3764-5002RB
3M
Connector
N3627-6002RB
3M
Connector
N3627-5002RB
3M
Connector
N3440-6002RB
3M
Connector
929715-03-36-I
3M
Connector
929667-02-36-I
3M
Connector
929665-04-36-I
3M
Connector
929665-02-36-I
3M
Connector
929647-04-36-I
3M
Connector