FTS-102-03-L-DV-TR SAMTEC Connector (Other) In Stock
The SAMTEC FTS-102-03-L-DV-TR is a 4-position, double-row, vertical surface-mount micro low-profile header strip with gold-over-nickel mating contacts and tin-over-nickel termination, designed for compact PCB-to-PCB signal connections in space-constrained electronics.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- FTS-102-03-L-DV-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 4-position double-row configuration (2×2) for compact high-density SMT board-to-board connections
- Gold (10 µin) over nickel (50 µin) mating contact finish for reliable low-resistance electrical connections
- Micro low-profile height minimizing stacked board clearance in compact module designs
- Phosphor bronze contact material providing excellent spring compliance and long mating cycle life
- Tape-and-reel (TR) packaging enabling high-volume automated SMT pick-and-place assembly
Applications
The FTS-102-03-L-DV-TR is used in compact PCB stacking and board-to-board signal routing for consumer electronics, wearables, and IoT modules where minimizing connector height is critical. The double-row SMT configuration allows 4 signal paths in a minimal PCB footprint, ideal for USB interface boards, sensor modules, and development kits requiring reliable mated connections. Tape-and-reel packaging supports high-throughput SMT assembly lines in production environments.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2Weeks |
| YTEOL | 9.4 |
| Additional Feature | LOW PROFILE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 4.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 4 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for FTS-102-03-L-DV-TR:
Frequently Asked Questions
What contact finish does FTS-102-03-L-DV-TR use and how many mating cycles does it support reliably?
The FTS-102-03-L-DV-TR uses 10 microinches of gold over 50 microinches of nickel on the mating contacts, which is a standard finish for connectors rated to at least 100 mating cycles. The gold surface maintains low contact resistance (typically below 20 mΩ) even after repeated insertions, while the nickel barrier protects the phosphor-bronze base from diffusion and corrosion.
How does FTS-102-03-L-DV-TR's low-profile SMT design benefit compact module stacking compared to through-hole alternatives?
The micro low-profile SMT design of FTS-102-03-L-DV-TR reduces the total stacked board height compared to through-hole headers, which protrude several millimeters beyond the PCB surface. In applications like sensor modules, wireless MCU boards, and wearable devices where total stack height may be limited to under 5 mm, the SMT low-profile header provides the needed board-to-board connectivity within tighter mechanical envelopes.
When should a designer choose FTS-102-03-L-DV-TR over a single-row 2-position SMT header for a 4-signal interface?
The FTS-102-03-L-DV-TR double-row 2×2 layout places 4 signals in roughly half the linear PCB length of a single-row 1×4 header on the same pitch. If PCB edge space is limited or the interface requires differential signal pairing (2 pairs side by side), the double-row arrangement reduces crosstalk by keeping signal pairs physically adjacent across 4 positions while maintaining a smaller SMT footprint.
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