ERJP08F10R0VAlternatives & Equivalent Parts
About ERJP08F10R0V
ERJP08F10R0V is a Resistor component manufactured by Panasonic. It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | ERJP08F10R0VSource | ERA3AEB272V | ERA6AEB123V | ZVP1320FTA | D2899-42 |
|---|---|---|---|---|---|
| Manufacturer | Panasonic | Panasonic | Panasonic | Diodes Inc. | Harwin |
| Package Type | Other | Other | Other | SOT23 (3-Pin) | Header, Receptacle - Straight PTH Box |
| Pin Count | 2 | 2 | 2 | 3 | 2 |
| Temperature Range | -55.0°C ~ 155.0°C | -55.0°C ~ 155.0°C | -55.0°C ~ 155.0°C | ~ 150.0°C | -55.0°C ~ 125.0°C |
| Price | $0.0405 | $0.0419 | $0.0315 | $0.2430 | $1.0300 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||
| Pbfree Code | Yes | Yes | Yes | Yes | Yes |
| Reach Compliance Code | Compliant | Compliant | Compliant | — | — |
| YTEOL | 12 | 14 | 14 | 7 | 7.48 |
| Construction | Rectangular | Rectangular | Rectangular | — | — |
| JESD-609 Code | e3 | e3 | e3 | e4 | e3 |
| Mounting Feature | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | — | — |
| Package Height | 0.6 mm | 0.45 mm | 0.5 mm | — | — |
| Package Length | 3.2 mm | 1.6 mm | 2 mm | — | — |
| Package Shape | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR | — |
| Package Style | SMT | SMT | SMT | SMALL OUTLINE | — |
| Package Width | 1.6 mm | 0.8 mm | 1.25 mm | — | — |
| Packing Method | TR, PUNCHED, 7 INCH | TR, PUNCHED PAPER, 7 INCH | TR, PUNCHED PAPER, 7 INCH | — | — |
| Rated Power Dissipation (P) | 0.66 W | 0.1 W | 0.125 W | — | — |
| Rated Temperature | 70 °C | 85 °C | 85 °C | — | — |
| Reference Standard | AEC-Q200, IEC60115-8 | AEC-Q200, IEC60115-8 | AEC-Q200, IEC60115-8 | — | — |
| Resistance | 10 Ω | 2700 Ω | 12000 Ω | — | — |
| Resistor Type | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | — | — |
| Size Code | 1206 | 0603 | 0805 | — | — |
| Surface Mount | YES | YES | YES | YES | — |
| Technology | METAL GLAZE/THICK FILM | THIN FILM | THIN FILM | — | — |
| Temperature Coefficient | 100 ppm/°C | 25 ppm/°C | 25 ppm/°C | — | — |
| Terminal Finish | MATTE TIN OVER NICKEL | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Nickel/Palladium/Gold (Ni/Pd/Au) | — |
| Terminal Shape | WRAPAROUND | WRAPAROUND | WRAPAROUND | — | — |
| Tolerance | 1% | 0.1% | 0.1% | — | — |
| Working Voltage | 500 V | 75 V | 100 V | — | — |
| Factory Lead Time | — | — | 12 Weeks | 12 Weeks | — |
| Configuration | — | — | — | SINGLE | — |
| DS Breakdown Voltage-Min | — | — | — | 200 V | — |
| Drain Current-Max (ID) | — | — | — | 0.035 A | — |
| Drain-source On Resistance-Max | — | — | — | 80 Ω | — |
| FET Technology | — | — | — | METAL-OXIDE SEMICONDUCTOR | — |
| Feedback Cap-Max (Crss) | — | — | — | 5 pF | — |
| JESD-30 Code | — | — | — | R-PDSO-G3 | — |
| Number of Elements | — | — | — | 1 | — |
| Operating Mode | — | — | — | ENHANCEMENT MODE | — |
| Package Body Material | — | — | — | PLASTIC/EPOXY | — |
| Peak Reflow Temperature (Cel) | — | — | — | 255 | — |
| Polarity/Channel Type | — | — | — | P-CHANNEL | — |
| Power Dissipation-Max (Abs) | — | — | — | 0.33 W | — |
| Qualification Status | — | — | — | Not Qualified | — |
| Terminal Form | — | — | — | GULL WING | — |
| Terminal Position | — | — | — | DUAL | — |
| Time@Peak Reflow Temperature-Max (s) | — | — | — | 30 | — |
| Transistor Element Material | — | — | — | SILICON | — |
| Body Breadth | — | — | — | — | 0.104 inch |
| Body Depth | — | — | — | — | 0.154 inch |
| Body Length | — | — | — | — | 0.3 inch |
| Contact Finish Mating | — | — | — | — | NOT APPLICABLE |
| Contact Finish Termination | — | — | — | — | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Material | — | — | — | — | NOT SPECIFIED |
| Contact Style | — | — | — | — | RND PIN-SKT |
| Device Socket Type | — | — | — | — | IC SOCKET |
| Device Type Used On | — | — | — | — | SIP3 |
| Housing Material | — | — | — | — | GLASS FILLED POLYAMIDE |
| Insulation Resistance | — | — | — | — | 100000000 Ω |
| Mating Contact Pitch | — | — | — | — | 0.2 inch |
| Mounting Style | — | — | — | — | STRAIGHT |
| Number of Contacts | — | — | — | — | 3 |
| PCB Contact Pattern | — | — | — | — | RECTANGULAR |
| Terminal Pitch | — | — | — | — | 5.08 mm |
| Termination Type | — | — | — | — | SOLDER |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 4 alternatives for ERJP08F10R0V — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for ERJP08F10R0V is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating ERJP08F10R0V replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to ERJP08F10R0V?
Known equivalents for ERJP08F10R0V include ERA3AEB272V, ERA6AEB123V, ZVP1320FTA. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of ERJP08F10R0V?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify ERJP08F10R0V alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.