ERF8-025-07.0-L-DV-EGP-TR SAMTEC Connector (Other) In Stock
SAMTEC ERF8-025-07.0-L-DV-EGP-TR is a 25-position dual-row board stacking socket connector with Edge Rate contacts and 7.0 mm stack height. Features tin-over-nickel finish and 1.024" body length. RoHS compliant. Available worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Category
- Connector
- Price
- From $4.0988(MOQ 25)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of ERF8-025-07.0-L-DV-EGP-TR?
- Edge Rate (ERF8) contact technology provides superior high-frequency signal integrity for board stacking at 7.0 mm stack height
- 25-position dual-row socket with tin-over-nickel contact finish for low-resistance mating in demanding environments
- E.L.P. (Extended Leadframe Package) design optimizes impedance control for high-speed differential signal applications
What is ERF8-025-07.0-L-DV-EGP-TR used for?
The ERF8-025-07.0-L-DV-EGP-TR is designed for high-speed board stacking applications in FPGAs, ASICs, and signal processing modules where maintaining signal integrity across 7.0 mm stack heights is critical. Its Edge Rate contact geometry minimizes discontinuities at high data rates, making it ideal for telecommunications, data center networking, and military electronics. The dual-row 25-position layout provides 50 signal connections in a compact 1.024 inch footprint.
What are the specifications of ERF8-025-07.0-L-DV-EGP-TR?
| Factory Lead Time | 4 Weeks, 5 Days |
| YTEOL | 8.68 |
| Additional Feature | EDGE RATE CONTACT, E.L.P |
| Body Breadth | 0.22inch |
| Body Depth | 0.275inch |
| Body Length | 1.024inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | TIN OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 675VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 50000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.031inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.4958mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 1.4A |
| Reference Standard | UL |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 50 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Where can I find the ERF8-025-07.0-L-DV-EGP-TR datasheet?
ERF8-025-07.0-L-DV-EGP-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for ERF8-025-07.0-L-DV-EGP-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height and pin count does the ERF8-025-07.0-L-DV-EGP-TR support?
The ERF8-025-07.0-L-DV-EGP-TR provides a 7.0 mm board-to-board stack height with 25 positions in a dual-row socket configuration, delivering 50 total contacts. The 1.024 inch body length and Edge Rate contact design make it suitable for compact high-density board stacking applications in high-speed electronics.
How do Edge Rate contacts in the ERF8-025-07.0-L-DV-EGP-TR improve signal performance?
Edge Rate contacts in the ERF8-025-07.0-L-DV-EGP-TR feature a controlled geometry that reduces impedance discontinuities at high data rates, ensuring clean signal transmission across the 7.0 mm board stack. This makes the connector suitable for multi-gigabit differential signals in data center, FPGA, and telecommunications equipment operating at GHz frequencies.
When would an engineer select the ERF8-025-07.0-L-DV-EGP-TR over a standard board stacking connector?
An engineer would select the ERF8-025-07.0-L-DV-EGP-TR when high-speed signal integrity is a priority over a 7.0 mm stack height with 25 dual-row positions. The Edge Rate contact and E.L.P. design features are justified in applications exceeding standard connector bandwidth, such as multi-gigabit serial links in FPGA mezzanine cards and advanced telecom line cards.
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Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 25+ | $5.8556 | $146.39 |
| 50+ | $5.5758 | $278.79 |
| 100+ | $4.7500 | $475.00 |
| 300+ | $4.4830 | $1344.90 |
| 500+ | $4.1800 | $2090.00 |
| 600+ | $4.0987 | $2459.25 |
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