ERF8-025-07.0-L-DV-EGP-TR SAMTEC Connector (Other) In Stock

SAMTEC ERF8-025-07.0-L-DV-EGP-TR is a 25-position dual-row board stacking socket connector with Edge Rate contacts and 7.0 mm stack height. Features tin-over-nickel finish and 1.024" body length. RoHS compliant. Available worldwide with fast shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
ERF8-025-07.0-L-DV-EGP-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
52
Lifecycle
ACTIVE
Category
Connector
Price
From $4.0988(MOQ 25)
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of ERF8-025-07.0-L-DV-EGP-TR?

  • Edge Rate (ERF8) contact technology provides superior high-frequency signal integrity for board stacking at 7.0 mm stack height
  • 25-position dual-row socket with tin-over-nickel contact finish for low-resistance mating in demanding environments
  • E.L.P. (Extended Leadframe Package) design optimizes impedance control for high-speed differential signal applications

What is ERF8-025-07.0-L-DV-EGP-TR used for?

The ERF8-025-07.0-L-DV-EGP-TR is designed for high-speed board stacking applications in FPGAs, ASICs, and signal processing modules where maintaining signal integrity across 7.0 mm stack heights is critical. Its Edge Rate contact geometry minimizes discontinuities at high data rates, making it ideal for telecommunications, data center networking, and military electronics. The dual-row 25-position layout provides 50 signal connections in a compact 1.024 inch footprint.

What are the specifications of ERF8-025-07.0-L-DV-EGP-TR?

Factory Lead Time4 Weeks, 5 Days
YTEOL8.68
Additional FeatureEDGE RATE CONTACT, E.L.P
Body Breadth0.22inch
Body Depth0.275inch
Body Length1.024inch
Body/Shell StyleSOCKET
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingTIN OVER NICKEL
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleBELLOWED TYPE
DIN ConformanceNO
Dielectric Withstanding Voltage675VAC V
Filter FeatureNO
IEC ConformanceNO
Insulation Resistance50000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.031inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing4.4958mm
Plating Thickness10u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)1.4A
Reference StandardUL
Terminal Pitch0.8mm
Termination TypeSURFACE MOUNT
Total Number of Contacts50
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginFrance, Malaysia

Where can I find the ERF8-025-07.0-L-DV-EGP-TR datasheet?

ERF8-025-07.0-L-DV-EGP-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for ERF8-025-07.0-L-DV-EGP-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What stack height and pin count does the ERF8-025-07.0-L-DV-EGP-TR support?

The ERF8-025-07.0-L-DV-EGP-TR provides a 7.0 mm board-to-board stack height with 25 positions in a dual-row socket configuration, delivering 50 total contacts. The 1.024 inch body length and Edge Rate contact design make it suitable for compact high-density board stacking applications in high-speed electronics.

How do Edge Rate contacts in the ERF8-025-07.0-L-DV-EGP-TR improve signal performance?

Edge Rate contacts in the ERF8-025-07.0-L-DV-EGP-TR feature a controlled geometry that reduces impedance discontinuities at high data rates, ensuring clean signal transmission across the 7.0 mm board stack. This makes the connector suitable for multi-gigabit differential signals in data center, FPGA, and telecommunications equipment operating at GHz frequencies.

When would an engineer select the ERF8-025-07.0-L-DV-EGP-TR over a standard board stacking connector?

An engineer would select the ERF8-025-07.0-L-DV-EGP-TR when high-speed signal integrity is a priority over a 7.0 mm stack height with 25 dual-row positions. The Edge Rate contact and E.L.P. design features are justified in applications exceeding standard connector bandwidth, such as multi-gigabit serial links in FPGA mezzanine cards and advanced telecom line cards.

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
From $4.0988
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
25+$5.8556$146.39
50+$5.5758$278.79
100+$4.7500$475.00
300+$4.4830$1344.90
500+$4.1800$2090.00
600+$4.0987$2459.25
pcs
Unit price: $5.8556 · Total: $146.39

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

JW
James Wright
Supply Chain Director, CircuitPro Ltd, UK