EP2SGX30DF780C3NAlternatives & Equivalent Parts

EP2SGX30DF780C3N is marked OBSOLETE. Compare the equivalents below, check each part's lifecycle, and request a quote on a suitable replacement.

About EP2SGX30DF780C3N

EP2SGX30DF780C3N is a Integrated Circuit component manufactured by Intel. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterEP2SGX30DF780C3NSourceRK7002BMT116EP1S10F484C7NEP2AGX45DF25C6NEP2S15F484C3N
ManufacturerIntelROHM SemiconductorIntelIntelIntel
Package TypeBGAOtherBGABGABGA
Pin Count7803484572484
Temperature Range~ 85.0°C~ 85.0°C~ 85.0°C~ 85.0°C
Price$105.1148$0.0190$218.1818$457.4200
StockIn StockIn StockIn StockIn StockIn Stock
LifecycleOBSOLETEACTIVEOBSOLETEOBSOLETEOBSOLETE
Electrical Parameters
YTEOL06.5000
Clock Frequency-Max717 MHz500 MHz717 MHz
Combinatorial Delay of a CLB-Max4.45 ns4.45 ns
JESD-30 CodeS-PBGA-B780R-PDSO-G3S-PBGA-B484S-PBGA-B572S-PBGA-B484
JESD-609 Codee1e3e1e1e1
Number of CLBs33880120018056240
Number of Inputs361335260342
Number of Logic Cells33880105704295915600
Number of Outputs361335260334
Organization33880 CLBS1057 CLBS1805 CLBS6240 CLBS
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeBGA780,28X28,40BGA484,22X22,40BGA572,24X24,40BGA484,22X22,40
Package ShapeSQUARERECTANGULARSQUARESQUARESQUARE
Package StyleGRID ARRAYSMALL OUTLINEGRID ARRAYGRID ARRAY, HEAT SINK/SLUGGRID ARRAY
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAYFIELD PROGRAMMABLE GATE ARRAYFIELD PROGRAMMABLE GATE ARRAYFIELD PROGRAMMABLE GATE ARRAY
Qualification StatusNot QualifiedNot QualifiedNot QualifiedNot Qualified
Supply Voltage-Max1.25 V1.575 V0.93 V1.25 V
Supply Voltage-Min1.15 V1.425 V0.87 V1.15 V
Supply Voltage-Nom1.2 V1.5 V0.9 V1.2 V
Surface MountYESYESYESYESYES
TechnologyCMOS, 90 nmCMOS40 nmCMOS, 90 nm
Temperature GradeOTHERCOMMERCIAL EXTENDEDOTHEROTHER
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)Tin (Sn)Tin/Silver/Copper (Sn/Ag/Cu)Tin/Silver/Copper (Sn/Ag/Cu)Tin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALLGULL WINGBALLBALLBALL
Terminal Pitch1 mm1 mm1 mm1 mm
Terminal PositionBOTTOMDUALBOTTOMBOTTOMBOTTOM
Factory Lead Time21 Weeks
ConfigurationSINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min60 V
Drain Current-Max (ID)0.25 A
Drain-source On Resistance-Max3.2 Ω
FET TechnologyMETAL-OXIDE SEMICONDUCTOR
Number of Elements1
Operating ModeENHANCEMENT MODE
Peak Reflow Temperature (Cel)260
Polarity/Channel TypeN-CHANNEL
Time@Peak Reflow Temperature-Max (s)10
Transistor ApplicationSWITCHING
Transistor Element MaterialSILICON

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 4 alternatives for EP2SGX30DF780C3N — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for EP2SGX30DF780C3N is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating EP2SGX30DF780C3N replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to EP2SGX30DF780C3N?

Known equivalents for EP2SGX30DF780C3N include RK7002BMT116, EP1S10F484C7N, EP2AGX45DF25C6N. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of EP2SGX30DF780C3N?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify EP2SGX30DF780C3N alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.