EEEFT1H470APAlternatives & Equivalent Parts

About EEEFT1H470AP

EEEFT1H470AP is a Capacitor Polarised component manufactured by Panasonic. It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterEEEFT1H470APSource865080242004AP1117E33G-137447702024AA64T-I/MC24AA64T-I/MNYTLV1701AIDRLR
ManufacturerPanasonicWürth ElektronikDiodes Inc.Würth ElektronikMicrochipMicrochipTexas Instruments
Package TypeOtherCapacitor Al ElectrolyticSOT223 (3-Pin)OtherSmall Outline No-leadSmall Outline No-leadSO Transistor Flat Lead
Pin Count2242885
Temperature Range-55.0°C ~ 105.0°C-55.0°C ~ 105.0°C-40.0°C ~ 125.0°C-40.0°C ~ 85.0°C-40.0°C ~ 85.0°C-40.0°C ~ 125.0°C
Price$0.1260$0.1264$0.1044$0.3838$0.4932$0.4512$0.6800
StockIn StockIn StockIn StockIn StockIn StockIn StockIn Stock
LifecycleACTIVEACTIVEOBSOLETEACTIVEACTIVEACTIVEACTIVE
Electrical Parameters
Pbfree CodeYesYesYesYesYes
Reach Compliance CodeCompliantCompliant
Factory Lead Time21 Weeks24 Weeks24 Weeks
YTEOL7150158815
Additional FeatureESR IS MEASURED AT 100KHZ
Capacitance47 µF47 µF
Capacitor TypeALUMINUM ELECTROLYTIC CAPACITORALUMINUM ELECTROLYTIC CAPACITOR
Diameter6.3 mm5 mm
Dielectric MaterialALUMINUM (WET)ALUMINUM (WET)
ESR680 mΩ
Height5.8 mm5.5 mm
JESD-609 Codee6e3e1e3e4e4
Leakage Current0.0235 mA0.0047 mA
Mounting FeatureSURFACE MOUNTSURFACE MOUNT
Negative Tolerance20%20%
Package ShapeCYLINDRICAL PACKAGERECTANGULARRECTANGULARRECTANGULARRECTANGULAR
Package StyleSMTSMTSMALL OUTLINESMTSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILESMALL OUTLINE, HEAT SINK/SLUG, VERY VERY THIN PROFILESMALL OUTLINE, VERY THIN PROFILE
Packing MethodTR, EMBOSSED, 15 INCHTR, EMBOSSED PLASTIC, 15 INCHTRTR, Embossed Plastic, 13 InchTR
PolarityPOLARIZEDPOLARIZED
Positive Tolerance20%20%
Rated (DC) Voltage (URdc)50 V10 V
Reference StandardAEC-Q200AEC-Q200
Ripple Current126.75 mA107.25 mA
Size Code26262121
Surface MountYESYESYESYESYESYESYES
Tan Delta0.100.19
Terminal FinishTin/Bismuth (Sn/Bi)MATTE TINTin/Silver/Copper (Sn/Ag/Cu)Matte Tin (Sn)Nickel/Palladium/Gold (Ni/Pd/Au)Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal ShapeFLATFLATWRAPAROUND
AdjustabilityFIXED
Dropout Voltage1-Max1.4 V
Dropout Voltage1-Nom1.3 V
Input Voltage Absolute-Max18 V
Input Voltage-Max12 V
Input Voltage-Min4.8 V
JESD-30 CodeR-PDSO-G3R-PDSO-N8R-PDSO-N8R-PDSO-F5
Line Regulation-Max0.0066%
Load Regulation-Max0.033%
Number of Functions11111
Number of Outputs1
Operating Temperature TJ-Max125 °C
Operating Temperature TJ-Min-20 °C
Output Current1-Max1 A
Output Voltage1-Max3.365 V
Output Voltage1-Min3.235 V
Output Voltage1-Nom3.3 V
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOT-223SOLCC8,.12,20SOLCC8,.12,20
Peak Reflow Temperature (Cel)260260260260
Qualification StatusNot QualifiedNot QualifiedNot Qualified
Regulator TypeFIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
TechnologyBIPOLARCMOSCMOSBIPOLAR
Terminal FormGULL WINGNO LEADNO LEADFLAT
Terminal Pitch2.3 mm0.5 mm0.5 mm0.5 mm
Terminal PositionDUALDUALDUALDUAL
Time@Peak Reflow Temperature-Max (s)30404030
Voltage Tolerance-Max2%
Case/Size Code4747
ConstructionRectangular
Core MaterialNICKEL-ZINC
DC Resistance0.14 Ω
Inductance-Nom (L)100 µH
Inductor ApplicationPOWER INDUCTOR
Inductor TypeGENERAL PURPOSE INDUCTOR
Package Height8 mm
Package Length12 mm
Package Width12 mm
Rated Current-Max2.2 A
Self Resonance Frequency5.2 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
ShieldedYES
Terminal PlacementDUAL ENDED
Test Frequency0.1 MHz
Tolerance20%
Manufacturer Package CodeDFN-8TDFN-8
Clock Frequency-Max (fCLK)0.4 MHz0.4 MHz
Data Retention Time-Min200200
Endurance1000000 Write/Erase Cycles1000000 Write/Erase Cycles
I2C Control Byte1010DDDR1010DDDR
Memory Density65536 bit65536 bit
Memory IC TypeEEPROMEEPROM
Memory Width88
Number of Ports11
Number of Words8192 words8192 words
Number of Words Code80008000
Operating ModeSYNCHRONOUSSYNCHRONOUS
Organization8KX88KX8
Output CharacteristicsOPEN-DRAINOPEN-DRAIN
Parallel/SerialSERIALSERIAL
Programming Voltage2.5 V2.5 V
Serial Bus TypeI2CI2C
Standby Current-Max0.000001 A0.000001 A
Supply Current-Max0.003 mA0.003 mA0.075 mA
Supply Voltage-Max (Vsup)5.5 V5.5 V
Supply Voltage-Min (Vsup)1.7 V1.7 V
Supply Voltage-Nom (Vsup)2.5 V2.5 V
Temperature GradeINDUSTRIALINDUSTRIALAUTOMOTIVE
Write Cycle Time-Max (tWC)5 ms5 ms
Write ProtectionHARDWAREHARDWARE
Amplifier TypeCOMPARATOR
Average Bias Current-Max (IIB)20 µA
Bias Current-Max (IIB) @25C0.015 µA
Input Offset Voltage-Max2500 µV
Output TypeOPEN-COLLECTOR; OPEN-DRAIN
Response Time-Nom560 ns
SubcategoryComparator
Supply Voltage Limit-Max40 V
## TLV1701AIDRLR Alternates Showing resultsImage

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 6 alternatives for EEEFT1H470AP — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for EEEFT1H470AP is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating EEEFT1H470AP replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to EEEFT1H470AP?

Known equivalents for EEEFT1H470AP include 865080242004, AP1117E33G-13, 74477020. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of EEEFT1H470AP?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify EEEFT1H470AP alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.