DTC114EETL ROHM Semiconductor Transistor (Other) In Stock
ROHM DTC114EETL is a digital NPN transistor with built-in 10 kΩ bias resistors in a compact EMT3 3-pin package, featuring 50 V collector-emitter voltage and 100 mA collector current for simplified logic-driven switching without external resistors.
- Manufacturer
- ROHM Semiconductor
- Package
- Other
- Pin Count
- 3
- Lifecycle
- ACTIVE
- Datasheet
- DTC114EETL Datasheet PDF
- Category
- Transistor
- Temp Range
- ?°C to 150.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Built-in 10 kΩ bias resistors (1:1 ratio) eliminate the need for external base resistors
- 50 V collector-emitter voltage rating for general-purpose NPN switching
- 100 mA maximum collector current for LED, relay, and small-load drive applications
- Compact EMT3 (SOT-416) 3-pin surface mount package for minimal PCB footprint
- Minimum DC current gain (hFE) of 30 ensures predictable switching behavior
Applications
The DTC114EETL is designed for logic-level switching in consumer electronics, portable devices, and industrial control circuits where microcontroller GPIO outputs directly drive loads without needing external base resistors. Its built-in 10 kΩ bias resistors simplify PCB design for LED indicators, relay drivers, and small motor switching at up to 100 mA collector current. The tiny EMT3 package and 50 V breakdown voltage make it ideal for space-constrained designs in IoT nodes, wearables, and smart home devices.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 18Weeks |
| YTEOL | 7 |
| Additional Feature | BUILT IN BIAS RESISTOR RATIO IS 1 |
| Collector Current-Max (IC) | 0.1A |
| Collector-Emitter Voltage-Max | 50V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR |
| DC Current Gain-Min (hFE) | 30 |
| JESD-30 Code | R-PDSO-G3 |
| JESD-609 Code | e1 |
| Number of Elements | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Polarity/Channel Type | NPN |
| Power Dissipation Ambient-Max | 0.15W |
| Power Dissipation-Max (Abs) | 0.15W |
| Qualification Status | Not Qualified |
| Surface Mount | YES |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | GULL WING |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Transistor Application | SWITCHING |
| Transistor Element Material | SILICON |
| Transition Frequency-Nom (fT) | 250MHz |
| VCEsat-Max | 0.3V |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8541.21.00.75 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How do the built-in resistors in DTC114EETL simplify circuit design compared to a standard 2N3904?
Unlike a standard 2N3904 which requires an external 10 kΩ base resistor for logic-level drive, the DTC114EETL integrates a 10 kΩ resistor network with a 1:1 bias ratio internally. This allows a microcontroller GPIO at 3.3 V or 5 V to directly switch a 100 mA load at up to 50 V collector-emitter voltage, saving two components and significant PCB space.
What load types can be switched using the DTC114EETL in a typical IoT design?
The DTC114EETL can switch loads drawing up to 100 mA at up to 50 V, covering LED arrays (typically 20 mA per LED), small relays (50-80 mA coil current), buzzer drivers, and low-power solenoids. Its built-in 10 kΩ bias resistors allow direct connection from a 3.3 V GPIO pin with no external components, simplifying IoT node BOM.
How does the EMT3 package size of the DTC114EETL compare to SOT-23, and is it suitable for automated assembly?
The EMT3 (SOT-416) package measures approximately 1.6 mm x 1.6 mm, notably smaller than the standard SOT-23 which measures 2.9 mm x 1.3 mm. Despite its tiny footprint, the DTC114EETL is fully compatible with standard SMT pick-and-place equipment and reflow soldering processes, making it excellent for high-density PCBs in wearable electronics and compact IoT devices where board space is at a premium.
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