DSPIC33EP256GP506-H/MR Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
Microchip DSPIC33EP256GP506-H/MR is a 16-bit digital signal controller with 256 KB flash, 32 KB RAM, and a 60 MHz core clock in a 64-pin QFN package. It integrates on-chip op-amps, a barrel shifter, and multiple internal buses for real-time control. Available in stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- DSPIC33EP256GP506-H/MR Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $5.2000(MOQ 100)
- Temp Range
- -40.0°C to 150.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 16-bit DSC core running at 60 MHz with 256 KB flash and 32 KB RAM for deterministic real-time digital signal processing
- Integrated on-chip op-amps reduce external component count in analog signal conditioning front-ends for motor control and power conversion
- 64-pin QFN package with boundary scan (JTAG) support enables compact PCB layout and in-circuit debugging of complex control firmware
Applications
The DSPIC33EP256GP506-H/MR is optimized for digital power conversion, motor drive, and industrial motion control applications where a 60 MHz 16-bit DSC with integrated op-amps and 256 KB flash is needed to run FOC or PID algorithms with deterministic cycle times. It is also used in solar inverters, UPS systems, and smart grid edge nodes where mixed signal processing and high-speed ADC sampling must be coordinated by a single compact 64-pin QFN controller.
Specifications
| Manufacturer Package Code | QFN-64 |
| Factory Lead Time | 7Weeks |
| YTEOL | 13 |
| Barrel Shifter | YES |
| Bit Size | 16 |
| Boundary Scan | YES |
| Clock Frequency-Max | 60MHz |
| Format | FIXED POINT |
| Integrated Cache | NO |
| Internal Bus Architecture | MULTIPLE |
| JESD-30 Code | S-PQCC-N64 |
| JESD-609 Code | e3 |
| Low Power Mode | NO |
| Number of DMA Channels | 4 |
| Number of External Interrupts | 3 |
| Number of Timers | 5 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC64,.35SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| RAM (words) | 32768 |
| ROM Programmability | FLASH |
| Screening Level | AEC-Q100; TS 16949 |
| Supply Current-Max | 60mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A001.A.2.A |
| HTS Code | 8542.31.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How much flash and RAM does the DSPIC33EP256GP506-H/MR provide, and how does this affect firmware complexity?
The DSPIC33EP256GP506-H/MR integrates 256 KB of program flash and 32 KB of data RAM, giving firmware developers enough space to store complex motor control lookup tables, communication stacks such as CANopen or MODBUS, and diagnostic logging buffers. At 60 MHz core clock, the device executes up to 70 MIPS, supporting real-time closed-loop control loops with sub-microsecond interrupt latency.
What role do the integrated op-amps play in a DSPIC33EP256GP506-H/MR motor control design?
The on-chip op-amps in the DSPIC33EP256GP506-H/MR amplify low-level current sense signals from a shunt resistor (typically in the milliamp to amp range) before feeding them to the internal ADC, eliminating the need for external op-amp ICs and their associated passive components. This integration reduces the total BOM by 3 to 5 components per current feedback channel and shrinks the power stage PCB footprint in compact BLDC and PMSM drive designs.
Which package does the DSPIC33EP256GP506-H/MR use, and what debugging interfaces does it support?
The DSPIC33EP256GP506-H/MR is housed in a 64-pin QFN (quad flat no-lead) package with a thermal pad, providing efficient heat dissipation in high-switching-frequency power converter designs. It supports JTAG boundary scan for board-level testing and In-Circuit Serial Programming (ICSP) via a 2-wire interface, enabling in-system firmware updates and hardware verification without removing the device from the PCB.
When is the DSPIC33EP256GP506-H/MR preferred over a general-purpose ARM Cortex-M4 MCU in a power electronics application?
The DSPIC33EP256GP506-H/MR is preferred when a design requires the fixed-point 16-bit DSC instruction set optimized for power conversion math (Q15 multiply-accumulate in a single cycle at 60 MHz), integrated op-amps for current sensing, and Microchip's mature peripheral set including high-resolution PWM with 1.04 ns dead-time resolution. These hardware features reduce firmware complexity and latency compared to implementing equivalent functions in software on a general-purpose ARM Cortex-M4 without native op-amps.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $5.9500 | $595.00 |
| 1000+ | $5.4800 | $5480.00 |
| 5000+ | $5.2000 | $26000.00 |
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