DSD1791DBG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

DSD1791DBG4 is a Texas Instruments integrated circuit for industrial and embedded electronics. It provides 28 pins, -25°C to 85°C, Small Outline Packages. From RFQ pricing, in-stock sourcing supports worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
DSD1791DBG4Small Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
28
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-25.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of DSD1791DBG4?

  • DSD1791DBG4 integrated circuit backed by Texas Instruments documentation
  • 28 pins configuration supports BOM, footprint, and incoming-inspection checks
  • -25°C to 85°C operating-temperature context for environmental review
  • Small Outline Packages package detail helps match the approved PCB footprint
  • 28 pins, -25°C to 85°C, Small Outline Packages for engineering qualification and alternate comparison
  • RFQ-oriented sourcing path for production lots and worldwide shipping

What is DSD1791DBG4 used for?

DSD1791DBG4 is used in industrial electronics, embedded systems, repair sourcing, and production BOM support where integrated circuit selection affects fit, reliability, and sourcing continuity. Engineering and procurement teams use it for assemblies that need 28 pins, manufacturer documentation, and controlled alternates before volume builds.

What are the specifications of DSD1791DBG4?

YTEOL0
Analog Output Voltage-Max3.2V
Converter TypeD/A CONVERTER
Input Bit CodeBINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
Input FormatSERIAL
JESD-30 CodeR-PDSO-G28
JESD-609 Codee4
Number of Bits24
Number of Functions1
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeSSOP28,.3
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
Supply Current-Max16mA
Supply Voltage-Nom5V
Surface MountYES
TechnologyCMOS
Temperature GradeOTHER
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch0.65mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
HTS Code8542.39.00.40

Where can I find the DSD1791DBG4 datasheet?

DSD1791DBG4 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for DSD1791DBG4?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

For new layouts, what makes DSD1791DBG4 suitable around 28 pins?

DSD1791DBG4 is suited to industrial electronics, embedded systems, repair sourcing, and production BOM support when the design needs 28 pins. Confirm 28 pins, -25°C to 85°C, Small Outline Packages against the manufacturer drawing before PCB release.

How should an RFQ team qualify DSD1791DBG4 before worldwide shipment?

Procurement should verify lifecycle status, datasheet revision, approved manufacturer, and 28 pins against the BOM. This keeps substitutions controlled before allocation, inspection, or worldwide shipping.

Which application constraints make DSD1791DBG4 the preferred listed option?

Compare nearby Texas Instruments variants by footprint, electrical limits, mating geometry, and 28 pins. Choose DSD1791DBG4 only when 28 pins, -25°C to 85°C, Small Outline Packages matches the approved assembly process.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy