DS90C031W-QMLV Texas Instruments Integrated Circuit (Other) In Stock
DS90C031W-QMLV is a quad LVDS line driver from Texas Instruments with 0.45 V differential output swing compliant with IEEE 1596.3 in a 16-pin CFPAK package. Features 4 differential output channels with 10 µA high-level input current and RoHS-compliant construction. Available from stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- DS90C031W-QMLV Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Quad (4-channel) LVDS differential line driver with 0.45 V output swing, enabling high-speed serial data transmission up to hundreds of Mbps over twisted-pair or PCB differential traces
- IEEE 1596.3 SCI-LVDS compliant with QMLV military qualification for use in high-reliability space, avionics, and defense applications
- 16-pin hermetic ceramic flatpack (CFPAK) package with RoHS compliance and very low 10 µA high-level input current for minimal host driver loading
Applications
DS90C031W-QMLV is designed for high-reliability military, aerospace, and space applications requiring robust LVDS differential signal transmission in harsh radiation or temperature environments. Its 4 independent LVDS driver channels are well-suited for point-to-point backplane interconnects, camera link interfaces, and inter-board high-speed data links in avionics and satellite systems. The QMLV qualification and hermetic ceramic flatpack packaging ensure long-term reliability in mission-critical defense and space electronics.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | LG_MAX |
| Differential Output | YES |
| Driver Number of Bits | 4 |
| High Level Input Current-Max | 0.00001A |
| Input Characteristics | STANDARD |
| Interface IC Type | LINE DRIVER |
| Interface Standard | IEEE 1596.3 |
| JESD-30 Code | R-GDFP-F16 |
| JESD-609 Code | e0 |
| Number of Functions | 4 |
| Out Swing-Min | 0.25V |
| Output Characteristics | 3-STATE |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | FL16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | FLATPACK |
| Qualification Status | Not Qualified |
| Screening Level | MIL-PRF-38535 Class V |
| Supply Current-Max | 30mA |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 4.5V |
| Supply Voltage-Nom | 5V |
| Supply Voltage1-Max | 5.5V |
| Supply Voltage1-Min | 4.5V |
| Supply Voltage1-Nom | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | FLAT |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Transmit Delay-Max | 5ns |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | 9A515.E.1 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the output voltage swing of DS90C031W-QMLV and which interface standard does it comply with?
DS90C031W-QMLV produces a differential output swing of 0.45 V and complies with the IEEE 1596.3 SCI-LVDS standard. This low-voltage swing reduces electromagnetic emissions and power consumption compared to RS-422 or LVPECL alternatives, making it suitable for high-speed differential links in radiation-hardened and military avionics systems operating at data rates above 100 Mbps.
How many LVDS driver channels does DS90C031W-QMLV provide and what qualification level does it carry?
DS90C031W-QMLV provides 4 independent differential LVDS driver channels in a single 16-pin package, with a QMLV (Qualified Manufacturers List, Level V) military qualification. This qualification makes it appropriate for space and defense electronics where component traceability, radiation tolerance, and thermal performance from -55 degrees C to +125 degrees C are required.
What package does DS90C031W-QMLV use and how does it compare to commercial LVDS drivers for board integration?
DS90C031W-QMLV is housed in a 16-pin ceramic flatpack (CFPAK) hermetic package, which differs from the plastic SOIC or TSSOP packages used in commercial LVDS drivers. The hermetic ceramic construction provides superior moisture resistance and thermal stability for harsh environments, while the high-level input current of only 10 µA (0.00001 A) ensures minimal loading on driving logic in space and avionics designs.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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