DRA829VMTGBALFR Texas Instruments Integrated Circuit (BGA) In Stock
DRA829VMTGBALFR is a 0Bit 27MHz integrated circuit by Texas Instruments. Key specs: 0Bit, 27MHz, 827 pins. From quote-based pricing, in stock with worldwide shipping for production sourcing.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 827
- Lifecycle
- OBSOLETE
- Datasheet
- DRA829VMTGBALFR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of DRA829VMTGBALFR?
- Integrated Circuit function with 0Bit, 27MHz, 827 pins
- BGA footprint context for BOM matching and assembly review
- -40°C to 105°C operating range for environmental qualification checks
- Traceable Texas Instruments manufacturer data with datasheet-backed sourcing details
What is DRA829VMTGBALFR used for?
Used in industrial electronics, embedded hardware, repair builds, and production BOM sourcing where 0Bit, 27MHz, 827 pins must match the approved design envelope. It also fits OEM repair, alternate sourcing, and production BOM planning that require traceable Texas Instruments supply.
What are the specifications of DRA829VMTGBALFR?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Bit Size | 64 |
| Boundary Scan | YES |
| Clock Frequency-Max | 27MHz |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B827 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of External Interrupts | 1 |
| Number of Serial I/Os | 31 |
| On Chip Data RAM Width | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA827,29X29,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 250 |
| RAM (words) | 3670016 |
| Screening Level | AEC-Q100; ISO 26262-ASIL D |
| Speed | 2000MHz |
| Supply Voltage-Max | 0.84V |
| Supply Voltage-Min | 0.76V |
| Supply Voltage-Nom | 0.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.50 |
| Country of Origin | South Korea |
Where can I find the DRA829VMTGBALFR datasheet?
DRA829VMTGBALFR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for DRA829VMTGBALFR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design requirements make DRA829VMTGBALFR suitable for a new integrated circuit design?
DRA829VMTGBALFR is a practical choice when the design needs 0Bit, 27MHz, 827 pins. The integrated circuit context from Texas Instruments gives engineers a concrete 0Bit reference during schematic and BOM review.
How should procurement teams verify DRA829VMTGBALFR before a build release?
Buyers should confirm the BGA package, 27MHz, manufacturer traceability, lifecycle status, and requested quantity before release. This reduces substitution risk during production sourcing and worldwide shipping.
Where does DRA829VMTGBALFR fit in a production BOM?
DRA829VMTGBALFR commonly fits industrial electronics, embedded hardware, repair builds, and production BOM sourcing. The available context includes 827 pins, helping buyers compare electrical fit, approved alternates, and sourcing risk before committing inventory.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
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